Semiconductor Package Layout With Exposed Edge Connector Bonding
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Solution Overview
Problem
The miniaturization of electronic products has led to challenges in heat dissipation and antenna efficiency in system-in-package (SIP) configurations, which are not adequately addressed by existing technologies.
Innovation Solution
A semiconductor device package design that includes a carrier with electronic components encapsulated by an encapsulant, where a connection element is partially exposed from the upper surface and edge of the encapsulant, allowing vertical bonding to a board structure, thereby improving heat dissipation and transmission performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are fully encapsulated in a SIP package, then protection and integration are improved, but heat dissipation and antenna efficiency deteriorate
Solution Approach 1:
The connection element is extracted from complete encapsulation and partially exposed from the encapsulant. This allows the connection element to serve dual functions: electrical connection and heat dissipation pathway, while maintaining the protective encapsulation of other components.
Solution Approach 2:
The encapsulant is designed with differentiated regions: fully encapsulated areas for protected components and partially encapsulated areas for the connection element. This local quality variation enables different functional zones within the same package structure.
2Reliability
If connection elements are fully enclosed in encapsulant, then protection is improved, but board area and connection efficiency deteriorate
Solution Approach 1:
The connection element is extracted from complete encapsulation to enable vertical bonding configuration. This reduces the horizontal board area footprint while maintaining protective encapsulation where needed.
Solution Approach 2:
The connection element transitions from a horizontal planar arrangement to a vertical three-dimensional configuration by protruding from the encapsulant surface. This dimensional change reduces board area occupation while improving connection efficiency.
3Temperature
If connection elements are exposed from encapsulant, then heat dissipation and transmission performance are improved, but manufacturing complexity increases
Solution Approach 1:
The connection element is positioned and partially exposed during the encapsulation process itself, rather than requiring subsequent complex post-processing steps. This preliminary action simplifies manufacturing by integrating the exposure function into the primary encapsulation operation.
Data Source
AI summary
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.