Semiconductor Package With Embedded Passive Components
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Solution Overview
Problem
Current technologies face limitations in reducing the height of mobile DRAM packages while maintaining electrical performance, particularly due to thickness constraints in printed circuit boards and the need for improved memory package design to stabilize driving voltage and reduce signal transmission loss.
Innovation Solution
A semiconductor package design that integrates a wiring structure with embedded passive components within the encapsulant, allowing for reduced thickness and enhanced electrical performance by using redistribution layers and wiring layers to connect passive components, thereby stabilizing the driving voltage and simplifying the printed circuit board design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of PCB and other components is reduced to decrease package height, then the height of mobile DRAM package is reduced, but the electrical performance and voltage stability deteriorate
Solution Approach 1:
The patent merges the PCB function with the encapsulant by integrating redistribution patterns directly into the encapsulant structure. This eliminates the need for a separate thick PCB layer while maintaining electrical connection functionality, thus reducing overall package height without compromising electrical performance
Solution Approach 2:
The patent transitions electrical connections from a planar PCB-based approach to a three-dimensional wiring structure within the encapsulant, using multiple wiring layers (first, second, and third wiring layers) connected through vias. This vertical integration reduces the horizontal footprint and allows for thinner overall package design while maintaining electrical performance
2Stability of the object's composition
If decoupling capacitor is added to stabilize driving voltage, then voltage stability is improved, but device complexity increases
Solution Approach 1:
The decoupling capacitor is integrated within the encapsulant structure itself, sharing the same space and structural framework as the semiconductor chip and wiring layers. This eliminates the need for separate capacitor components and reduces overall package complexity while maintaining voltage stability functionality
Solution Approach 2:
The encapsulant serves multiple functions simultaneously: it provides mechanical protection for the semiconductor chip, establishes electrical connections through integrated redistribution patterns, and houses decoupling capacitors for voltage stabilization. This multi-functionality reduces the need for separate dedicated components
Data Source
AI summary
A semiconductor package includes a semiconductor chip having connection pads on one surface thereof, a first encapsulant covering at least portions of the semiconductor chip, and a connection structure disposed on the one surface of the semiconductor chip and including one or more redistribution layers electrically connected to the connection pads. A wiring structure is disposed on one surface of the first encapsulant opposing another surface of the first encapsulant facing towards the connection structure. The wiring structure has a passive component embedded therein, and includes one or more wiring layers electrically connected to the passive component. The one or more redistribution layers and the one or more wiring layers are electrically connected to each other.