Semiconductor Package EMI Shielding and Heat Dissipation Design
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Solution Overview
Problem
Semiconductor packages face challenges in shielding electromagnetic interference (EMI) and dissipating heat effectively, leading to potential device malfunctions due to signal interference and heat generation in multifunctional chips.
Innovation Solution
A semiconductor package design incorporating a ground line unit with diagonal and vertical ground lines to isolate signal lines and a heat dissipation unit featuring a thermal interface material (TIM) and heat dissipation plate, which effectively shields EMI and dissipates heat by grounding the barrier walls and using high thermal conductivity materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If signal lines are integrated closely in multifunctional chips, then area is reduced and design is compact, but electromagnetic interference increases and heat dissipation becomes difficult
Solution Approach 1:
The chip area is segmented into multiple functional regions by barrier walls that divide the substrate into first and second areas. These barrier walls create isolated zones for different signal types, preventing electromagnetic interference while maintaining compact integration. The ground line units are also segmented into multiple diagonal and vertical lines distributed across the substrate to provide localized grounding for each region.
Solution Approach 2:
Barrier walls serve as intermediary structures between different signal line groups, providing electromagnetic shielding through their conductive or grounded nature. Ground line units act as intermediaries by providing dedicated grounding paths that mediate between signal lines and the reference potential, preventing interference without requiring increased spacing between signals.
2Area of stationary object
If signal lines are integrated closely in multifunctional chips, then area is reduced and design is compact, but heat generation increases leading to malfunction
Solution Approach 1:
The substrate is divided into multiple thermal management zones using barrier walls, allowing heat from different functional areas to be managed independently. This segmentation enables targeted heat dissipation strategies for high-power regions while maintaining compact overall design.
Solution Approach 2:
The barrier walls serve multiple functions simultaneously: they provide electromagnetic shielding to prevent interference between signal lines and act as thermal management structures that facilitate heat dissipation. This multi-functionality allows the same structural elements to address both EMI and thermal issues without increasing area.
3Object-affected harmful factors
If barrier walls are added to shield EMI between signal lines, then signal interference is reduced, but device complexity increases
Solution Approach 1:
The barrier walls are designed to serve dual purposes: electromagnetic shielding and thermal management. By integrating these multiple functions into a single structural element, the design achieves EMI protection without proportionally increasing complexity, as the same walls also manage heat dissipation.
Solution Approach 2:
The grounding function and EMI shielding function are merged into the barrier wall structure. Ground line units are integrated with the barrier walls, combining what could be separate components into a unified structure that reduces overall device complexity while maintaining shielding effectiveness.
4Object-affected harmful factors
If ground line units are added to contact barrier walls for shielding, then EMI protection is improved, but manufacturing complexity increases
Solution Approach 1:
The ground line units are merged with the barrier wall formation process. Both structures are created simultaneously or in an integrated sequence during manufacturing, reducing the number of discrete fabrication steps. The ground lines extend from the barrier walls in a continuous pattern that can be formed in a single lithography and deposition cycle.
Solution Approach 2:
The ground line units are pre-configured in their final positions during the barrier wall formation process. The diagonal and vertical ground lines are established beforehand to contact the barrier walls at optimal locations, eliminating the need for subsequent alignment or adjustment steps that would increase manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents EMI and enhances heat dissipation, preventing device malfunctions and improving signal integrity by isolating signal types and efficiently discharging heat, thereby ensuring reliable operation of semiconductor devices.
Implementation Method 1
a heat dissipation unit having high thermal conductivity... a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate
Data Source
AI summary
A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom, a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another, barrier walls configured to contact the ground line unit, and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit includes diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit includes a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate.