Semiconductor Package EMI Shield Using Segmented Through-Structures
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Solution Overview
Problem
Semiconductor devices are susceptible to external electromagnetic interference (EMI) from sources like radios, cell phones, and power lines, leading to performance degradation and malfunctions.
Innovation Solution
A semiconductor package design incorporating a lower and upper interconnection structure with through-structures that provide EMI shielding, including first and second through-structures surrounding the semiconductor chip, where the second through-structures are spaced apart from the upper interconnection layer to enhance EMI shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-structures are used to electrically connect lower and upper interconnection structures, then electrical connectivity is improved, but EMI shielding effectiveness deteriorates
Solution Approach 1:
The through-structures are segmented into two types: first through-structures that penetrate the encapsulant for electrical connection, and second through-structures that do not penetrate the encapsulant and are spaced apart from the upper interconnection layer to provide EMI shielding. This segmentation allows each type to perform its specific function without compromising the other.
Solution Approach 2:
Different regions of the package are assigned different properties: the first through-structures provide electrical connectivity in specific locations, while the second through-structures are strategically positioned in other regions to provide EMI shielding. The spacing of second through-structures from the upper interconnection layer creates localized shielding zones without affecting electrical connections.
2Object-affected harmful factors
If second through-structures are spaced apart from the upper interconnection layer, then EMI shielding effectiveness is improved, but electrical connectivity may be compromised
Solution Approach 1:
The through-structures are divided into two functional groups: first through-structures that maintain electrical connectivity by penetrating the encapsulant and connecting to the upper interconnection layer, and second through-structures that provide EMI shielding by being spaced apart from the upper interconnection layer. This segmentation ensures that electrical connectivity and EMI shielding functions are fulfilled by different structures.
Solution Approach 2:
The package structure achieves multi-functionality by incorporating both first and second through-structures within the same system. The first through-structures handle electrical connectivity, while the second through-structures handle EMI shielding, allowing the overall system to fulfill multiple functions simultaneously without requiring separate systems for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively blocks EMI signals by spacing second through-structures apart from the upper interconnection layer, improving the semiconductor package's EMI shielding performance.
Implementation Method 1
each of the plurality of second through-structures is electrically connected to the lower interconnection layer and is spaced apart from the upper interconnection layer in a vertical direction... effectively blocks EMI signals by spacing second through-structures apart from the upper interconnection layer
Data Source
AI summary
A semiconductor package including an electromagnetic interference shield includes a lower interconnection structure including a lower insulating layer and a lower interconnection layer, a lower semiconductor chip disposed on the lower interconnection structure, an encapsulant on the lower interconnection structure and covering at least a portion of the lower semiconductor chip, an upper interconnection structure disposed on the encapsulant, a plurality of first through-structures disposed in the encapsulant and electrically connecting the lower interconnection structure and the upper interconnection structure, a plurality of second through-structures disposed in the encapsulant and around the lower semiconductor chip and the plurality of first through-structures, and an upper chip structure electrically connected to the upper interconnection layer, and wherein each of the plurality of second through-structures is electrically connected to one of the lower interconnection layer or the upper interconnection layer and is spaced apart from the other in a vertical direction.