Semiconductor Package Shielding Cover for Compact EMI Protection
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Solution Overview
Problem
Semiconductor chips in packages are prone to abnormal operation due to electromagnetic interference (EMI), and existing shielding methods are inadequate as the distance between packages decreases in smaller electronic products.
Innovation Solution
A method of fabricating a semiconductor package involves mounting chips on a substrate, forming a shielding wall around them, creating a molded body, and covering it with a shielding cover to effectively mitigate EMI. This includes using a package substrate with a solder resist layer and protrusions, and depositing molding material to encapsulate the chips, with the shielding wall and cover made of conductive materials for efficient electromagnetic radiation shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic interference shielding is enhanced by reducing package distance, then shielding effectiveness is improved, but device complexity increases due to additional shielding structures
Solution Approach 1:
The patent combines the shielding wall and shielding cover into an integrated shielding structure that encapsulates the semiconductor chip. The shielding wall extends from the package substrate to form sidewalls, while the shielding cover forms a top surface, creating a unified Faraday cage structure that reduces EMI without requiring separate complex shielding components.
Solution Approach 2:
The patent employs thin conductive shielding walls and shielding covers that form flexible encapsulation around the semiconductor chip. These thin-walled structures create effective electromagnetic shielding through their continuous conductive surfaces, achieving high shielding effectiveness without adding significant structural complexity or volume.
2Object-affected harmful factors
If shielding structures are added to protect against EMI, then shielding effectiveness is improved, but manufacturing complexity increases due to additional fabrication steps
Solution Approach 1:
The patent forms the shielding wall structure before mounting the semiconductor chip and forming the molded body. The shielding wall is created as a preliminary structure on the package substrate, establishing the lateral boundaries of the encapsulation space before subsequent assembly steps, which simplifies the overall manufacturing sequence.
Solution Approach 2:
The patent divides the shielding structure into two functional segments: a shielding wall that extends vertically from the package substrate to form sidewalls, and a shielding cover that forms the top surface. This segmentation allows each component to be formed and positioned independently, simplifying the fabrication process while achieving complete electromagnetic enclosure.
3Object-affected harmful factors
If a comprehensive shielding structure is formed to encapsulate chips, then EMI protection is improved, but device volume increases due to additional shielding components
Solution Approach 1:
The patent implements a nested shielding structure where the shielding wall and shielding cover are positioned immediately around the molded body encapsulating the semiconductor chip. The shielding structures are tightly fitted to the chip package dimensions, creating a compact Faraday cage that provides comprehensive EMI protection without adding excessive external volume.
Solution Approach 2:
The patent uses thin-walled shielding structures that provide effective electromagnetic shielding with minimal material thickness. The shielding wall and shielding cover are formed as thin conductive enclosures that maintain effective shielding performance while minimizing the volume increase of the overall package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method effectively reduces EMI, ensuring stable operation of semiconductor chips by forming a comprehensive shielding structure that encapsulates and covers the chips, thereby enhancing the electromagnetic interference shielding of semiconductor packages.
Implementation Method 1
forming a shielding wall that extends around sides of the at least one semiconductor chip above the package substrate... and forming a shielding cover that covers the molded body and contacts the shielding wall
Data Source
AI summary
A method of fabricating a semiconductor package includes mounting at least one semiconductor chip to a package substrate, forming a shielding wall around the at least one semiconductor chip, forming a molded body on the package substrate in a space surrounded by the shielding wall, and forming a shielding cover covering the molding unit and in contact with the shielding wall.