Semiconductor Package Shielding Layout for All-Side EMI Coverage
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Solution Overview
Problem
Conventional semiconductor package EMI shielding solutions are limited to only the upper quadrants, lacking a reliable and cost-effective all-aspect shielding solution.
Innovation Solution
A semiconductor package design featuring a substrate with a first face mounted with a semiconductor component and connectors, where a first shielding member covers the component and a group of connectors while exposing another group, and a second shielding member provides multi-face coverage on the opposing face, with both shielding members being physically separated and formed from conductive materials for enhanced EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional EMI shielding solutions are applied only to upper quadrants of the package, then the shielding cost is reduced and the structure is simplified, but the EMI protection is incomplete and lacks all-aspect coverage
Solution Approach 1:
The shielding structure is divided into multiple independent shielding members, each covering different faces or regions of the package. This segmentation allows for targeted EMI protection on specific faces while maintaining manufacturing simplicity, resolving the contradiction between comprehensive coverage and structural complexity.
Solution Approach 2:
Different faces of the package receive shielding treatment based on their specific EMI exposure requirements. The shielding members are selectively applied to upper, lower, lateral, or front/rear faces depending on the local EMI risk, achieving all-aspect protection without uniformly complicating the entire structure.
2Object-affected harmful factors
If shielding members are added to achieve all-aspect EMI coverage, then the EMI protection is improved, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The manufacturing process is segmented into separate steps for different shielding members, allowing each to be applied independently to specific faces. This reduces the complexity of any single manufacturing step while achieving comprehensive EMI coverage through the combination of multiple simpler steps.
Solution Approach 2:
Shielding members are applied to only those faces that require EMI protection rather than coating the entire package. This partial action approach reduces material usage and manufacturing complexity while still achieving effective all-aspect shielding where needed.
3Object-affected harmful factors
If a complete all-aspect shielding structure is implemented, then EMI protection is comprehensive, but the package size increases and thermal dissipation paths are blocked
Solution Approach 1:
The shielding is segmented into discrete members positioned on different faces, allowing thermal paths to remain open between and around these members. This segmentation enables comprehensive EMI coverage without creating a solid enclosure that would block thermal dissipation, maintaining compact package dimensions.
Solution Approach 2:
The shielding members are implemented as thin conductive layers or films rather than thick enclosures. These thin films provide effective EMI shielding while occupying minimal volume and allowing thermal energy to pass through or around them, preventing significant increases in package size.
4Object-affected harmful factors
If shielding members are applied to all faces of the package, then EMI protection is maximized, but the number of components increases and assembly becomes more difficult
Solution Approach 1:
The shielding system is segmented into a small number of strategically positioned members that collectively provide all-aspect coverage. By carefully selecting which faces require shielding and positioning members to cover multiple adjacent faces, the total number of components is minimized while maintaining comprehensive protection.
Solution Approach 2:
Adjacent shielding members are merged or interconnected to form continuous shielding barriers across edges and corners of the package. This merging reduces the number of discrete components and simplifies assembly while ensuring no EMI leakage paths exist at the boundaries between shielding members.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves comprehensive electromagnetic interference shielding and thermal dissipation across all aspects of the package, reducing EMI and enhancing thermal management while maintaining a compact package size.
Implementation Method 1
a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors
Implementation Method 2
both shielding members being physically separated and formed from conductive materials for enhanced EMI shielding
Data Source
AI summary
A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a substrate having a first face and an opposing second face, wherein the first face is mounted with a first semiconductor component and a plurality of connectors; and a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors.