Semiconductor Package EMI Shielding via Embedded Chip Member
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Solution Overview
Problem
Current semiconductor packages face challenges in reducing size and weight while effectively addressing electromagnetic interference (EMI) issues, particularly due to the complexity and cost of manufacturing electromagnetic shielding structures, and the risk of short circuits and coating failures during the cutting process.
Innovation Solution
The semiconductor package incorporates an electromagnetic shielding member that is integrated within the chip, electrically connected to a ground member and covering the non-active surface, with a shape that can be either a number sign (#) or pillar structures, to enhance EMI shielding without surrounding the side surface, thus simplifying manufacturing and reducing the risk of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic shielding structures are added to suppress EMI, then electromagnetic interference characteristics are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The electromagnetic shielding member is integrated with the semiconductor chip structure, merging the shielding function into the chip itself rather than adding separate shielding components. This integration reduces overall device complexity while maintaining EMI suppression effectiveness.
Solution Approach 2:
The electromagnetic shielding member is divided into multiple portions that pass through the semiconductor chip at different locations. These segmented portions are electrically connected to form a complete shielding structure, allowing flexible integration without surrounding the entire side surface.
2Object-affected harmful factors
If electromagnetic shielding structures are added to suppress EMI, then electromagnetic interference characteristics are improved, but weight and size increase
Solution Approach 1:
The electromagnetic shielding member covers only specific regions of the semiconductor chip where EMI protection is most needed, rather than providing complete 360-degree shielding. This partial coverage approach maintains effective EMI suppression while minimizing additional weight and size.
3Object-affected harmful factors
If electromagnetic shielding member covers side surface, then EMI shielding is improved, but risk of short circuit and coating failure increases
Solution Approach 1:
The electromagnetic shielding member is extracted from completely surrounding the side surface and is instead integrated through specific penetration holes in the chip. This extraction eliminates the short circuit risk associated with coating the entire side surface while maintaining EMI shielding effectiveness through strategic placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves EMI shielding performance, simplifies the manufacturing process, and reduces the risk of short circuits and coating failures, while maintaining the compactness and reliability of semiconductor packages.
Implementation Method 1
an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip
Data Source
AI summary
A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.