Multi-Sided EMI Shielding in Semiconductor Packages to Prevent Warpage
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Solution Overview
Problem
Conventional semiconductor packages face issues such as excess cost, decreased reliability, inadequate shielding, and large package sizes, which lead to electromagnetic interference (EMI) and warpage problems.
Innovation Solution
A semiconductor package design that includes a substrate with electronic devices on both surfaces, covered by moldings and an EMI shielding layer to prevent warpage and shield against electromagnetic interference, with conductive bumps for electrical connectivity and a jig used to form the shielding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but reliability decreases and warpage occurs
Solution Approach 1:
The package structure is divided into multiple functional layers including substrate, molding layers, EMI shielding layer, and underfill material, with each layer serving specific purposes to collectively improve reliability while managing complexity through functional segmentation
Solution Approach 2:
The package employs composite material structures including the combination of EMI shielding material with molding compound, and the use of underfill material between substrate and device, creating composite structures that enhance reliability and prevent warpage
2Object-affected harmful factors
If conventional packaging without EMI shielding is used, then manufacturing cost is lower, but electromagnetic interference occurs
Solution Approach 1:
The EMI shielding layer is integrated into the molding process by combining EMI shielding material with the molding compound material, creating a unified structure that provides both encapsulation and EMI shielding functions, thereby reducing manufacturing steps and costs while effectively blocking electromagnetic interference
Solution Approach 2:
The EMI shielding layer acts as an intermediary barrier between external electromagnetic sources and the semiconductor device, absorbing or reflecting EMI to protect the device while being integrated into the overall package structure to minimize manufacturing complexity
3Stability of the object's composition
If conventional molding without warpage prevention is used, then manufacturing is simpler, but warpage occurs
Solution Approach 1:
The underfill material is applied between the substrate and the semiconductor device to counterbalance thermal expansion stresses and mechanical forces that cause warpage, acting as a compensating layer that maintains substrate stability during thermal cycling and operation
Solution Approach 2:
The underfill material is applied in advance before final device assembly and encapsulation, pre-positioning the stress-compensating layer to prevent warpage from occurring during subsequent manufacturing steps and device operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents warpage and shields against EMI, enhancing the reliability and reducing costs by providing comprehensive protection and efficient electrical connectivity.
Implementation Method 1
an electromagnetic interference (EMI) shielding layer formed to cover the first molding, the substrate, and the second molding
Implementation Method 2
a plurality of first conductive bumps formed on the second surface to be electrically connected to the substrate
Data Source
AI summary
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.