Semiconductor Package With Integrated EMI Shielding Window
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Solution Overview
Problem
Conventional semiconductor package manufacturing methods are inefficient and costly due to the manual adhesion of lids, which complicates the assembly process and increases production costs, especially when producing large quantities of devices that require electromagnetic interference (EMI) shielding.
Innovation Solution
A semiconductor package manufacturing method involving the use of plastic windows (pockets) formed by inject-molding, which are adhered to a substrate using an adhesive and then cut into discrete devices, reducing manual labor and costs while allowing for EMI shielding layers to be integrated within the windows for devices like MEMS microphones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If manual adhesion of lids is used, then EMI shielding can be achieved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent combines the lid adhesion process with the semiconductor chip mounting process by integrating the lid onto the lead frame before chip attachment. This merging of operations eliminates separate manual adhesion steps, reducing manufacturing complexity while maintaining EMI shielding through the integrated lid structure.
Solution Approach 2:
The lid is pre-attached to the lead frame in advance before the semiconductor chip is mounted. This preliminary action allows the EMI shielding structure to be prepared beforehand, simplifying the overall manufacturing process and reducing the complexity of subsequent assembly steps.
2Object-affected harmful factors
If manual adhesion of lids is used, then EMI shielding can be achieved, but production cost increases
Solution Approach 1:
By merging the lid adhesion with the chip mounting process, the patent eliminates redundant manual operations. This integration reduces labor costs and production time, thereby lowering the overall production cost while maintaining the necessary EMI shielding functionality.
Solution Approach 2:
Preparing the lid-attached lead frame in advance enables standardized, pre-configured components to be used during assembly. This preliminary preparation reduces on-site manual work and associated costs, making EMI shielding more cost-effective in mass production.
3Object-affected harmful factors
If manual adhesion of lids is used, then EMI shielding can be achieved, but productivity decreases
Solution Approach 1:
The integration of lid adhesion with chip mounting creates a single, streamlined process flow. This merging eliminates the need for separate manual adhesion steps, significantly improving production efficiency and throughput while ensuring EMI shielding is maintained through the integrated structure.
Solution Approach 2:
By pre-attaching lids to lead frames, the patent enables faster assembly during production. This preliminary preparation allows for rapid, standardized installation during chip mounting, thereby increasing overall productivity without compromising EMI shielding performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method streamlines the assembly process and significantly reduces manufacturing costs by automating the adhesion and cutting of package arrays, while maintaining the ability to integrate EMI shielding layers for improved device performance.
Implementation Method 1
a window (e.g., a pocket of a molding) formed to surround the cavity region and made of a plastic material attached to the substrate through an adhesive
Data Source
AI summary
Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.