Semiconductor Package Structure with Encapsulant Passages for Thermal Management
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Solution Overview
Problem
In 3D stacked semiconductor packages, heat dissipation is inefficient due to poor thermal conductivity of covering compounds and difficulty in exposing elements for direct heat dissipation, leading to poor airflow and heat dissipation performance.
Innovation Solution
A semiconductor package structure with a passage defined by encapsulant portions that allows air or liquid to flow directly, exposing semiconductor elements for improved heat dissipation, and a manufacturing method involving a cover material and encapsulant formation to create these passages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If elements are covered by compound in 3D stacked structure, then integration is achieved, but heat dissipation becomes difficult
Solution Approach 1:
The encapsulant is divided into multiple separate portions (first encapsulant portion, second encapsulant portion, etc.) that are spaced apart from each other. This segmentation creates passages between the encapsulant portions, allowing heat to be dissipated through multiple pathways while maintaining the protective coverage function.
Solution Approach 2:
The encapsulant structure is designed with passages (void spaces) between its portions, creating a porous-like structure. These passages allow airflow or liquid flow to directly contact the semiconductor elements, enabling efficient heat dissipation while the encapsulant portions continue to provide protection and integration.
2Temperature
If molding or processing means are used to expose elements, then heat dissipation can be improved, but structure formation becomes difficult
Solution Approach 1:
The passages are formed during the encapsulant formation process itself, before final assembly. The encapsulant portions are positioned and cured to create the passage structure in advance, eliminating the need for subsequent complex laser drilling or plasma processing to create heat dissipation pathways.
Solution Approach 2:
The encapsulant portions automatically create the passage structure through their spatial arrangement and curing process. The passages form as inherent void spaces between the encapsulant portions, requiring no additional processing steps to expose the semiconductor elements for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by allowing direct airflow or liquid flow through the passages, improving thermal management in semiconductor packages.
Implementation Method 1
allowing air to flow in and out (e.g., to readily directly contact a semiconductor element)... allows air or liquid to flow directly, exposing semiconductor elements for improved heat dissipation
Implementation Method 2
the heat generated by the elements while in operation is more difficult to dissipate... improving heat dissipation... improving thermal management in semiconductor packages
Data Source
AI summary
A semiconductor package structure includes a package substrate, an encapsulant, at least one passage and at least one semiconductor element. The encapsulant is disposed on the package substrate and has a peripheral surface, and includes a first encapsulant portion and a second encapsulant portion spaced apart from the first encapsulant portion. The at least one passage is defined by the first encapsulant portion and the second encapsulant portion, and the passage has at least one opening in the peripheral surface of the encapsulant. The at least one semiconductor element is disposed on the package substrate and exposed in the passage.