Semiconductor Package Substrate Module With Integrated ESD Grounding
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Solution Overview
Problem
Conventional semiconductor package substrate modules face challenges with electrostatic discharge (ESD) protection, as traditional ESD protection ICs and passive components lead to space constraints, increased power consumption, and signal delay in miniature electronic products, reducing overall efficiency.
Innovation Solution
A semiconductor package assembly with a substrate featuring first electrical contact points, grounding transfer areas, and encapsulating bodies, where second wires connect to grounding transfer pads and extend to the surface for effective ESD protection, allowing for flexible installation and reduced space occupation while maintaining reliability and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional ESD protection ICs or passive components are used, then electrostatic discharge protection is provided, but space constraints occur in miniature electronic products
Solution Approach 1:
The patent merges the ESD protection function with the substrate grounding structure by integrating grounding transfer areas directly into the substrate. This combines what were previously separate components (ESD protection ICs/passive components and substrate) into a unified structure, eliminating the need for additional discrete ESD protection components and reducing overall space occupation in miniature electronic products
Solution Approach 2:
The substrate is designed to serve multiple functions: it provides mechanical support, electrical connection, and integrated ESD protection through the grounding transfer areas. This multi-functional design eliminates the need for separate dedicated ESD protection components, thereby reducing space requirements while maintaining comprehensive protection capability
2Reliability
If traditional ESD protection ICs or passive components are used, then electrostatic discharge protection is provided, but power consumption increases
Solution Approach 1:
The patent extracts the active ESD protection IC component from the design and replaces it with passive grounding transfer areas integrated into the substrate. By removing the active protection IC that consumes power and using only passive conductive structures for ESD protection, the design eliminates unnecessary power consumption while maintaining ESD protection capability
Solution Approach 2:
The design uses simple passive conductive structures (grounding transfer areas) instead of complex active ESD protection ICs. These passive structures require no power and have no operational lifespan limitations, providing reliable ESD protection without the power consumption and reliability issues associated with active protection components
3Reliability
If traditional ESD protection ICs or passive components are used, then electrostatic discharge protection is provided, but signal transmission delay increases
Solution Approach 1:
The patent removes the ESD protection IC from the signal path by integrating ESD protection directly into the substrate through grounding transfer areas. This extraction eliminates the additional signal transmission delay that would occur through separate protection IC components, as the grounding path is now directly integrated into the substrate structure
Solution Approach 2:
The grounding transfer areas are pre-integrated into the substrate structure during substrate fabrication, establishing the ESD protection path before final assembly. This preliminary integration ensures that the ESD protection path is optimally positioned and minimizes signal transmission delay by eliminating the need for additional external protection components in the signal path
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced ESD protection, reducing signal interference and component damage, while allowing for flexible design and cost-effective mass production, without compromising the integrity of the packaged substrate module.
Implementation Method 1
the other end of the at least one second wire extending to and exposed from the at least one surface of the encapsulating body
Data Source
AI summary
The semiconductor package substrate module including a substrate, a plurality of first wires, at least one second wire, a chip, and an encapsulating body, wherein the first wires electrically connect to a first electrical contact point of the substrate and a second electrical contact point of the chip. Besides, one end of the at least one second wire connects to the at least one grounding transfer area or a first ground contact point of the substrate, and another end of the second wire extends toward a cutting area. The encapsulating body encapsulates the substrate, the first and second wires, and the chip. The semiconductor package substrate module is cut and separated along the cutting area of the substrate to form a plurality of semiconductor packaging components. A side surface of the encapsulating body exposes the first wires or at least one second wire of each semiconductor packaging component.