Semiconductor Package Switch Circuit for CDM ESD Isolation
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Solution Overview
Problem
Integrated circuit (IC) chips are vulnerable to destructive electro-static discharge (ESD) during fabrication, assembly, and final application, necessitating improved ESD protection to prevent electro-static damage.
Innovation Solution
A semiconductor package with a switch protection circuit that disconnects semiconductor chips during a charged device model (CDM) discharge to prevent static charges from flowing into the ground, using NMOS transistors and capacitive elements to manage the connection state of the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the semiconductor chips are connected during normal operation, then the normal operation function is improved, but the vulnerability to ESD damage increases
Solution Approach 1:
The patent implements a dynamic switching mechanism using a switch circuit that can change the connection state between semiconductor chips based on operational conditions. During normal operation, the switch connects the chips to enable data transmission and communication. During ESD events, the switch disconnects the chips to prevent damage, thus dynamically adapting the system state to resolve the contradiction between operational connectivity and ESD protection.
Solution Approach 2:
The switch circuit acts as an intermediary component between the semiconductor chips and the external environment. This intermediary can control the flow of electrical current, allowing normal signal transmission while blocking harmful ESD currents. The switch serves as a protective mediator that enables beneficial electrical connections while preventing harmful ones, resolving the contradiction between operational needs and damage prevention.
2Reliability
If the switch protection circuit is added to disconnect chips during CDM discharge, then the reliability against ESD is improved, but the device complexity increases
Solution Approach 1:
The switch circuit is designed to perform multiple functions: during normal operation, it enables data transmission and chip communication; during ESD events, it provides protection by disconnecting the chips. This multi-functionality allows a single component to address both operational requirements and protection needs, improving reliability without proportionally increasing overall system complexity.
Solution Approach 2:
The switch circuit changes its electrical parameters (conductance state) based on operational conditions. By transitioning between high-conductance state during normal operation and low-conductance state during ESD events, the circuit adapts its behavior to meet different requirements. This parameter-based control allows the system to achieve high reliability protection while maintaining relatively simple circuit architecture through state transitions rather than complex structural designs.
Data Source
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AI summary
The present disclosure relates to a semiconductor package. The semiconductor package includes: a first semiconductor chip; at least one second semiconductor chip; and a switch protection circuit having a first end connected with the first semiconductor chip and a second end connected with each of the at least one second semiconductor chip, wherein when the semiconductor package is undergoing a charged device model (CDM) discharge, the switch protection circuit is in off state to disconnect the first semiconductor chip and the second semiconductor chip. Thus, it is possible to reduce the probability of burning the semiconductor package by the static electricity discharge when the semiconductor package is in the CDM discharge.