Resin-Sealed Semiconductor Package With Exposed Heat Sinks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
General semiconductor devices packaged with resin, such as epoxy resin and silica, have low thermal conductivity, hindering effective thermal dissipation.
Innovation Solution
A semiconductor device design featuring a substrate with a memory controller and nonvolatile memory separated by heat sinks and sealed with a resin body, where the heat sinks are made of high thermal conductivity materials like copper, aluminum, or silver, and are exposed on the package surface to enhance thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor device is packaged with resin (epoxy resin and silica), then the device is protected and sealed, but the thermal dissipation performance deteriorates due to low thermal conductivity of the resin
Solution Approach 1:
The patent divides the package into multiple sections: a resin-sealed portion for protection and a heat-dissipating portion with exposed heat sinks for thermal management. This segmentation allows each portion to fulfill its specific function optimally without compromising the other.
Solution Approach 2:
Different portions of the package are assigned different material properties and functions. The resin-sealed portion provides protection with electrical insulation, while the heat-dissipating portion uses thermally conductive materials (aluminum, copper, or diamond) to optimize heat transfer. This local differentiation resolves the contradiction between protection and thermal performance.
2Temperature
If heat sinks are exposed on the package surface, then thermal dissipation is enhanced, but the device complexity increases due to additional structural components
Solution Approach 1:
The heat sinks are integrated with the semiconductor components (controller and nonvolatile memory) to form a unified thermal management system. The heat sinks serve dual purposes: thermal dissipation and structural support, reducing the need for separate cooling components and simplifying the overall device architecture.
Solution Approach 2:
The heat sinks perform multiple functions: they dissipate heat from the semiconductor components, provide mechanical support, and serve as part of the package structure. This multi-functionality reduces device complexity by eliminating the need for separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves thermal dispersion characteristics by effectively dissipating heat generated from the memory controller and nonvolatile memory through the heat sinks, enhancing the device's thermal management.
Implementation Method 1
the heat sinks are made of high thermal conductivity materials like copper, aluminum, or silver, and are exposed on the package surface to enhance thermal dissipation
Data Source
AI summary
According to one embodiment, a semiconductor device includes: a substrate; a controller disposed on the substrate; a nonvolatile memory disposed on the substrate to be separated from the controller; a first heat sink disposed in contact with an upper surface of the controller; a second heat sink disposed in contact with an upper surface of the nonvolatile memory; and a first resin sealing body sealing the controller, the nonvolatile memory, the first heat sink, and the second heat sink. The first heat sink and the second heat sink are exposed on at least one surface selected from the group consisting of an upper surface and a side surface of the first resin sealing body.