Semiconductor Package Antenna Layout With Exposed RF Surfaces
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Solution Overview
Problem
As working frequencies increase in wireless communication devices, signal attenuation or signal loss of RF signals becomes worse due to the influence of dielectric layers on antenna performance.
Innovation Solution
The proposed semiconductor device package includes a substrate with a support structure having a step structure, where at least two surfaces of the antenna are not covered by a protection layer or dielectric layer, allowing exposure to air or vacuum, enhancing the antenna's performance by reducing the impact of dielectric materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna is covered by a dielectric layer for protection, then the antenna structure is protected and integrated into the package, but the antenna performance deteriorates due to signal attenuation and loss
Solution Approach 1:
The patent divides the antenna structure into multiple segments: a first antenna portion that remains exposed without dielectric coverage, and a second antenna portion that is covered by the dielectric layer. This segmentation allows the antenna to maintain protected integration while preserving signal transmission performance through the exposed portion.
Solution Approach 2:
Different portions of the antenna are assigned different structural qualities: the first antenna portion has a quality of being exposed (no dielectric layer) to minimize signal loss, while the second antenna portion has a quality of being covered (dielectric layer present) for protection and integration. This local differentiation resolves the contradiction between protection and performance.
2Strength
If dielectric materials are used to support and protect the antenna, then the antenna is mechanically supported and protected, but signal loss increases due to dielectric interference
Solution Approach 1:
The antenna is segmented into exposed and covered portions, allowing mechanical support structures to be provided selectively. The exposed first antenna portion maintains signal transmission quality, while the covered second antenna portion receives mechanical support and protection from dielectric materials.
Solution Approach 2:
Mechanical support quality is differentiated locally: the first antenna portion has minimal or no dielectric support to reduce signal loss, while the second antenna portion has full dielectric support for mechanical strength and protection. This local quality differentiation resolves the contradiction between mechanical support and signal loss.
Data Source
AI summary
A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.