Semiconductor Package Layout With Exposed Surfaces for Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor devices face challenges in heat dissipation as the amount of heat generated in semiconductor elements increases, leading to insufficient heat dissipation via leads.
Innovation Solution
The semiconductor device incorporates a configuration with exposed surfaces of the semiconductor element and conductive members to enhance heat dissipation, including a sealing resin, conductive members with specific dimensions and exposed surfaces, and a plating layer to facilitate direct heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor element is completely covered by sealing resin for protection, then the reliability and protection of the semiconductor element is improved, but the heat dissipation capability deteriorates because heat cannot be efficiently dissipated from the covered surfaces
Solution Approach 1:
The patent applies local quality by selectively exposing specific surfaces of the semiconductor element (the main surface and side surfaces) while keeping other portions covered by sealing resin. This creates different protective and functional zones: exposed surfaces for heat dissipation and covered surfaces for protection, allowing simultaneous optimization of both reliability and thermal management
Solution Approach 2:
The patent segments the sealing coverage into distinct regions - fully exposing the main surface and side surfaces for heat dissipation while potentially covering other portions for protection. This segmentation allows the semiconductor element to have different functional zones for thermal management and environmental protection
2Temperature
If larger exposed surfaces are created on the semiconductor element for heat dissipation, then the heat dissipation capability is improved, but the volume of sealing resin increases and the structural compactness deteriorates
Solution Approach 1:
The patent utilizes the third dimension by exposing not only the main surface but also the side surfaces of the semiconductor element for heat dissipation. This vertical/dimensional expansion of heat dissipation area allows efficient thermal management without requiring additional lateral space or increasing sealing resin volume
3Reliability
If the semiconductor element is fully enclosed in sealing resin for environmental protection, then the protection from external factors is improved, but the heat dissipation path is blocked and heat dissipation deteriorates
Solution Approach 1:
The patent creates localized zones with different properties: exposed surfaces (main surface and side surfaces) for heat dissipation and sealed portions for environmental protection. This spatial differentiation allows the device to simultaneously achieve both protection from external factors and efficient heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration efficiently dissipates heat generated in the semiconductor element through exposed surfaces, reducing the volume of sealing resin and improving overall heat dissipation.
Implementation Method 1
the heat generated in the semiconductor element is dissipated through the bonding layer and the lead
Implementation Method 2
the heat generated in the semiconductor element is dissipated through the bonding layer and the lead
Data Source
AI summary
A semiconductor device includes a conductive member, a semiconductor element, and a sealing resin. The conductive member includes a wiring portion having first and second main surfaces respectively facing first and second sides in a thickness direction, and a terminal portion being connected to the wiring portion from the second side and having a third main surface facing the second side. The semiconductor element is on the second side with respect to the wiring portion, is bonded to the second main surface, and has first and second element main surfaces. The wiring portion has a first side surface facing orthogonal to the thickness direction. The terminal portion has a second side surface facing orthogonal to the thickness direction and connected to the first side surface. The second element main surface and at least one of the first and second side surfaces are exposed from the sealing resin.