Exposed Top Surface Semiconductor Package Heat Dissipation
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Solution Overview
Problem
The challenge is to design an electronic device with a semiconductor package that efficiently dissipates heat while maintaining a thin profile, as the miniaturization and high performance requirements of electronic devices necessitate effective heat management to prevent damage to semiconductor components.
Innovation Solution
The solution involves a semiconductor device package with a package substrate connected to a circuit board, where a first semiconductor device with higher heat generation is in contact with a heat dissipation structure and a molding that surrounds the sidewalls but not the top surface, and a thermal interface material (TIM) layer facilitates heat transfer, while a second semiconductor device with lower thermal resistance is protected from heat emitted by the first device through strategic positioning and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the semiconductor device package is miniaturized to meet high performance requirements, then the device thickness is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending the heat dissipation structure vertically above the first semiconductor device. This allows heat to be dissipated in the thickness direction rather than only laterally, effectively addressing heat management in miniaturized devices without increasing overall device thickness.
Solution Approach 2:
The heat dissipation structure is segmented into multiple regions: a first region directly above the first semiconductor device for primary heat dissipation, and a second region extending toward the second semiconductor device. This segmentation allows optimized thermal management for each semiconductor device while maintaining compact packaging.
2Adaptability or versatility
If multiple semiconductor devices are mounted side by side to increase functionality, then device performance is improved, but thermal interference between devices increases
Solution Approach 1:
The heat dissipation structure has different configurations in different regions: the first region provides direct heat dissipation for the first semiconductor device, while the second region is positioned to protect the second semiconductor device from thermal interference. This local differentiation allows each device to have optimized thermal characteristics suitable for its specific requirements.
Solution Approach 2:
The heat dissipation structure acts as a thermal intermediary between the two semiconductor devices. It provides a controlled thermal pathway for the first device while creating a thermal barrier that protects the second device, thereby mediating the thermal interaction between co-packaged devices.
3Reliability
If the molding covers the top surface of the first semiconductor device for protection, then device reliability is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The molding structure is segmented such that it covers the sidewalls and bottom of the first semiconductor device for protection, but intentionally leaves the top surface exposed. This segmentation allows the top surface to serve as a heat dissipation interface while the rest of the device remains protected by the molding.
Solution Approach 2:
The top surface of the first semiconductor device is extracted from the molding coverage area, creating an exposed region that serves as a dedicated heat dissipation interface. This extraction allows thermal management to take precedence over complete encapsulation for this specific surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat dissipation from the first semiconductor device to the heat dissipation structure, protecting the second device from thermal damage and reducing the overall thickness of the electronic device by optimizing heat transfer pathways and component placement.
Implementation Method 1
a thermal interface material (TIM) layer facilitates heat transfer
Data Source
AI summary
An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.