Semiconductor Package Leads for External Passive Component Mounting
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Solution Overview
Problem
Semiconductor packages face challenges in efficiently utilizing space due to the large occupation by passive components, which becomes more critical as package sizes decrease.
Innovation Solution
The semiconductor package design includes leads that emerge from the mold compound and extend upward toward the topmost surface, allowing passive components to be positioned outside the package, thereby preserving space within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If passive components are positioned inside the semiconductor package, then the package provides complete protection, but the package size increases and space utilization decreases
Solution Approach 1:
The patent extends conductive members (leads) from the traditional horizontal plane to emerge vertically from the mold compound toward the topmost surface. This three-dimensional configuration allows passive components to be positioned on the package exterior while maintaining electrical connectivity, effectively utilizing vertical space to reduce the package footprint without compromising protection.
Solution Approach 2:
The patent extracts passive components from the interior of the semiconductor package and positions them on the exterior surface. By taking out these components and connecting them via leads that emerge from the mold compound, the package interior space is freed up, reducing overall package size while the leads maintain the protective enclosure for critical components.
2Volume of moving object
If leads are configured in traditional gullwing shape only, then manufacturing is simple, but space utilization is inefficient and passive components cannot be positioned externally
Solution Approach 1:
The patent segments the lead structure into multiple functional portions: a first portion with traditional gullwing configuration for standard connections, and a second portion that extends vertically from the mold compound to accommodate externally mounted passive components. This segmentation allows the lead to serve dual purposes while maintaining manufacturability through standardized processes.
Solution Approach 2:
The lead structure is designed to perform multiple functions: it provides electrical connectivity for the semiconductor die, serves as a mounting substrate for passive components when extended vertically, and maintains mechanical support for the package structure. This multi-functional design improves space utilization without requiring entirely new manufacturing approaches.
3Quantity of substance
If the package is miniaturized to reduce cost and size, then manufacturing cost decreases, but space for passive components becomes insufficient
Solution Approach 1:
The patent resolves the space constraint by transitioning from two-dimensional planar arrangement to three-dimensional vertical arrangement. Leads emerge vertically from the mold compound at angles between 45-90 degrees, creating a multi-layer spatial configuration that accommodates passive components externally while minimizing the package footprint and reducing material requirements.
Data Source
AI summary
In some examples, a semiconductor package comprises a semiconductor die including a device side having a circuit; a mold compound covering the semiconductor die and the circuit; a first lead coupled to the circuit, the first lead having a gullwing shape and emerging from the mold compound in a first horizontal plane, the first lead having a distal end coincident with a second horizontal plane lower than a bottom surface of the mold compound; and a second lead coupled to the circuit, the second lead emerging from the mold compound in the first horizontal plane, the second lead having a distal end coincident with a third horizontal plane higher than a topmost surface of the mold compound, the distal end of the second lead vertically coincident with the mold compound.