Semiconductor Package With Field-Controlled Filler Distribution

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Solution Overview

Problem

Existing semiconductor packages face challenges in achieving small sizes and light weights while maintaining high-capacity data processing, as the positions of fillers in the molding member are randomly fixed, making it difficult to selectively control their distribution according to the type of semiconductor package.

Innovation Solution

The semiconductor package employs a molding member with fillers that include a non-electromagnetic core and an electromagnetic coating layer, allowing their positions to be controlled using an electric field or magnetic field, enabling targeted distribution and enhanced protection of semiconductor chips.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If fillers are randomly mixed in the molding member, then the manufacturing process is simple, but the positions of fillers cannot be selectively controlled according to semiconductor package type

Engineering Contradiction:

Improveselective control of filler distributionVSAvoidmolding member structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The molding member is designed with regions having different filler distributions - a first region with a first filler distribution and a second region with a second filler distribution. This local differentiation allows selective control of filler positions according to semiconductor package type while maintaining overall structural integrity.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The molding member structure is made adjustable by changing filler distribution patterns based on different semiconductor package types. The molding member can be reconfigured to have different filler distributions in different regions, enabling adaptability to various package types without requiring completely different molding members.

Inventive Principle:

Principle #15Dynamics

2Volume of moving object

If filler positions are fixed randomly, then the manufacturing process is easy, but it is difficult to achieve small sizes and light weights while maintaining high-capacity data processing

Engineering Contradiction:

Improvesemiconductor package sizeVSAvoidfiller position control

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

By creating regions with different filler distributions within the molding member, the patent enables optimized local properties that reduce package size and weight while maintaining high-capacity data processing capabilities. The specific filler distribution in each region can be tailored to the functional requirements of different semiconductor package types.

Inventive Principle:

Principle #3Local quality

3Reliability

If fillers are uniformly distributed, then the molding member structure is simple, but the protection efficiency of semiconductor chips cannot be optimized

Engineering Contradiction:

Improvechip protection efficiencyVSAvoidmolding member structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The molding member incorporates regions with different filler distributions to optimize chip protection efficiency. By varying the filler distribution in different regions, the patent enhances protective properties where needed while maintaining structural simplicity overall, thereby improving reliability without excessive complexity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the precise control of filler distribution, enabling the creation of smaller, lighter semiconductor packages with improved high-capacity data processing capabilities and reduced warpage, suitable for high integration and efficient protection of semiconductor chips.

Implementation Method 1

Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The fillers are configured to be moved in a certain direction in the molding member by an electric field or a magnetic field that may be applied to the molding member

Methodology Applied

Scientific EffectElectromagnetic interaction: Lorentz Force

Data Source

PatentUS11699626B2Semiconductor package and method of manufacturing the same

Publication Date: 2023.07.11 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.