Semiconductor Package Assembly With Electric Field Shielding
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Solution Overview
Problem
Semiconductor package assemblies for high voltage devices face challenges in maintaining minimum creepage and clearance distances due to size constraints, leading to potential reliability failures such as arcing and tracking, as per IEC60664-1 and IPC2221A standards.
Innovation Solution
Incorporation of electric field modulation structures within the molding resin case, specifically metal shielding plates that alter and limit electric fields between conductive connections, ensuring proper insulation and preventing voltage potential exposure at the package surface, with configurations such as angled or bent shielding plates to direct voltage potential towards the package edge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced to meet higher density electronics requirements, then the package density is improved, but the creepage and clearance distances between conductive parts are reduced below standard requirements
Solution Approach 1:
A molding resin case is introduced as an intermediary insulating material between conductive parts (lead frame and bond elements). The resin case physically separates these conductive elements while maintaining their electrical connectivity functions, thereby ensuring adequate creepage and clearance distances without increasing the overall package volume.
Solution Approach 2:
The molding resin case is designed to preemptively prevent electrical breakdown by providing insulation before arcing or tracking can occur. By pre-establishing adequate creepage and clearance paths through the insulating resin, the design prevents reliability failures that would otherwise occur in compact packages.
2Device complexity
If conductive parts are placed closer together to reduce package size, then the manufacturing complexity is reduced, but the risk of arcing and tracking failures increases
Solution Approach 1:
The molding resin case serves as a mediating insulating barrier between closely spaced conductive parts. This allows the package to maintain a simple structure with fewer components while the resin inherently prevents arcing and tracking by providing a high-resistance path between conductors.
Solution Approach 2:
The molding resin case converts the potential harm of close spacing into a benefit by utilizing the resin's dielectric properties. The same compact geometry that would normally increase arcing risk is made safe by the insulating resin, which actually enhances reliability in small packages by preventing electrical breakdown.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively limits electric fields to insulated areas, preventing arcing and tracking failures by encapsulating the shielding structures within the resin case, ensuring reliable operation even in high voltage applications.
Implementation Method 1
electric field modulation structures within the molding resin case, specifically metal shielding plates that alter and limit electric fields between conductive connections
Data Source
AI summary
A semiconductor package assembly and molding resin case is provided. The package includes a lead frame having a first and a second lead frame side opposite to the first; a semiconductor die structure having a first and a second die side opposite to the first, the die structure being mounted with its second die side on the first lead frame side, resulting in a first connection; a bond element connected to the first die of the die structure, resulting in another connection; with the molding resin case encapsulating at least the die structure, the lead frame and a first part of at least one bond element connected to the die structure, leaving the second lead frame side and the at least one bond element partly exposed; and at least one bond element is provided with electric field modulation structures configured to alter an electric field created between the connections.