Semiconductor Package Molding Layer with Region-Specific Filler Distribution

Solution Overview

Problem

Existing semiconductor packages face challenges in achieving both mechanical strength and formability, particularly as they become lighter and thinner, with smaller fillers improving strength but compromising formability, and larger fillers enhancing formability but reducing strength.

Innovation Solution

A semiconductor package design incorporating a molding layer with varying filler content percentages and sizes, utilizing an electrophoretic effect to distribute small and large fillers differently across upper and side surfaces, ensuring high concentration of small fillers on the upper surface and large fillers on the side surfaces to enhance mechanical strength without compromising formability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If smaller fillers are used in the molding layer, then mechanical strength is improved, but formability deteriorates

Engineering Contradiction:

Improvemechanical strengthVSAvoidformability

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent applies local quality by creating different filler compositions in different regions of the molding layer. The first region (upper surface area) contains a higher proportion of first fillers with smaller particle sizes to enhance mechanical strength, while the second region (side surface area) contains a higher proportion of second fillers with larger particle sizes to improve formability and reduce voids. This spatial variation in filler composition allows each region to optimize its properties for its specific functional requirements.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If larger fillers are used in the molding layer, then formability is improved, but mechanical strength deteriorates

Engineering Contradiction:

ImproveformabilityVSAvoidmechanical strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent applies local quality by creating different filler compositions in different regions of the molding layer. The first region (upper surface area) contains a higher proportion of first fillers with smaller particle sizes to enhance mechanical strength, while the second region (side surface area) contains a higher proportion of second fillers with larger particle sizes to improve formability and reduce voids. This spatial variation in filler composition allows each region to optimize its properties for its specific functional requirements.

Inventive Principle:

Principle #3Local quality

3Weight of moving object

If the semiconductor package is made lighter and thinner, then compactness is improved, but mechanical strength deteriorates

Engineering Contradiction:

Improvepackage weightVSAvoidmechanical strength

Core Design Contradiction:

Weight of moving objectVSStrength

Solution Approach 1:

The patent applies local quality by creating different filler compositions in different regions of the molding layer. The first region (upper surface area) contains a higher proportion of first fillers with smaller particle sizes to enhance mechanical strength, while the second region (side surface area) contains a higher proportion of second fillers with larger particle sizes to improve formability and reduce voids. This spatial variation in filler composition allows each region to optimize its properties for its specific functional requirements.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a semiconductor package with improved mechanical strength, particularly at the upper portion, while maintaining formability, thus reducing defects such as cracks.

Implementation Method 1

utilizing an electrophoretic effect to distribute small and large fillers differently across upper and side surfaces

Methodology Applied

Scientific EffectElectrophoretic effect: Electrophoresis

Data Source

PatentUS20250210430A1Semiconductor package and method for manufacturing the same

Publication Date: 2025.06.26 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package including a molding layer and a method for manufacturing the same are provided. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, and a molding layer on the semiconductor chip on the package substrate, the molding layer including a first filler having a first size and a second filler having a second size larger than the first size, wherein the molding layer includes a first area on an upper surface of the semiconductor chip, and a second area on a side surface of the first area, and wherein a ratio of a first content percentage of the first filler and a first content percentage of the second filler in the first area is different from a ratio of a second content percentage of the first filler and a second content percentage of the second filler in the second area.