Semiconductor Package Flange Layout for Dense Stable Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices with flanges positioned opposite each other across a main body experience instability and deteriorated stress-related characteristics when mounted at short intervals, leading to unstable mounting and potential deterioration of high-frequency characteristics.
Innovation Solution
A semiconductor device design with flanges arranged in a specific configuration, featuring notches or openings that allow for stable mounting by overlapping end portions and using a common fixture, enabling a shorter mounting interval and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are mounted at short intervals, then mounting density is improved, but stability and stress-related characteristics deteriorate
Solution Approach 1:
The flange structure employs asymmetric design where the first flange extends beyond the mounting surface while the second flange does not, creating different support conditions on opposite sides. This asymmetric configuration allows short mounting intervals while maintaining stability by providing differential mechanical support that compensates for stress accumulation in dense arrangements.
Solution Approach 2:
The invention transitions from planar mounting considerations to three-dimensional flange configuration. By utilizing vertical extension of the first flange above the mounting surface and positioning it asymmetrically, the solution adds a dimensional element that provides mechanical stability without increasing the horizontal mounting interval, thus resolving the contradiction between density and stability.
2Shape
If flanges are positioned opposite each other across the main body, then structural symmetry is improved, but mounting interval cannot be reduced
Solution Approach 1:
The patent deliberately breaks the symmetric positioning of flanges by extending only the first flange above the mounting surface while keeping the second flange at or below the mounting surface level. This asymmetric configuration allows reduction of the mounting interval while maintaining adequate structural support, as the extended first flange provides additional mechanical anchoring that compensates for the reduced spacing.
Solution Approach 2:
The first flange serves multiple functions: it provides mechanical support, extends beyond the mounting surface for enhanced anchoring, and enables shorter mounting intervals. This multi-functional design allows the flange structure to maintain structural integrity while accommodating reduced spacing between adjacent semiconductor devices.
Data Source
AI summary
A semiconductor device includes a semiconductor chip, and a package including an accommodating portion that houses the semiconductor chip, and a first flange and a second flange arranged along a first direction with the accommodating portion interposed therebetween. A lower surface of a first end portion of the first flange is positioned above a mounting surface of the accommodating portion, and a first distance between the lower surface of the first end portion and the mounting surface in a second direction is equal to or greater than a second distance between an upper surface of a second end portion of the second flange and the mounting surface in the second direction. The first end portion has a 10 first opening or a first notch penetrating the first end portion, and the second end portion has a second opening or a second notch penetrating the second end portion.