Semiconductor Package Handling System with Flip Mechanism

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for sorting and inspecting semiconductor packages are inefficient, unreliable, and costly due to limitations in inspecting multiple surfaces, unstable package positioning, and complex setup requirements, particularly for smaller packages.

Innovation Solution

A semiconductor package handling system with a package holder, first and second inspection devices for top and bottom surfaces, and offloading devices that allow for efficient sorting and inspection of multiple surfaces, using quadruple rotary pick arms and dual linear offloading arms with a gang précisor for alignment and simultaneous inspection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If inspection is done through glass holder, then packages can be held and inspected, but inspection results become unreliable due to glass quality and contamination

Engineering Contradiction:

Improveinspection reliabilityVSAvoidholder structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the glass holder from the inspection path by implementing a flip mechanism that exposes the mold side directly to the inspection device. The glass holder is replaced with a simple support structure that does not interfere with optical inspection, thereby eliminating contamination and quality issues while maintaining package holding capability.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a flipping mechanism that inverts the package orientation during handling. Instead of inspecting through the glass holder from one side, the package is flipped to expose the mold side directly to the inspection device, reversing the inspection approach to achieve reliable results without glass interference.

Inventive Principle:

Principle #13The other way round (Inversion)

2Stability of the object's composition

If buffer plate with guiding walls is used, then packages can be positioned, but fabrication cost increases and smaller packages cannot be securely held

Engineering Contradiction:

Improvepackage positioning stabilityVSAvoidfabrication cost

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent removes the complex buffer plate with guiding walls and replaces it with a simpler holding structure. The flip mechanism and offloading device work with a minimalistic holder design that eliminates the need for expensive guiding walls while maintaining adequate package positioning through the flipping and controlled offloading process.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of using complex mechanical guidance structures to position packages, the patent inverts the approach by using a simple holder combined with a flip mechanism that positions packages through controlled motion and orientation changes, achieving stable positioning without expensive fabrication.

Inventive Principle:

Principle #13The other way round (Inversion)

3Adaptability or versatility

If clearance between walls and packages is increased, then smaller packages can be accommodated, but package positioning becomes unstable

Engineering Contradiction:

Improvepackage size accommodationVSAvoidpackage positioning stability

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent resolves this contradiction by inverting the positioning approach: instead of relying on tight mechanical clearance for stability, it uses a flip mechanism with controlled motion that maintains package stability through dynamic control rather than static mechanical constraints, allowing adequate clearance for smaller packages while preserving positioning accuracy.

Inventive Principle:

Principle #13The other way round (Inversion)

4Adaptability or versatility

If multiple conversion kits are used for different packages, then various package types can be handled, but setup complexity and cost increase

Engineering Contradiction:

Improvepackage type compatibilityVSAvoidsetup complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a universal holder and flip mechanism design that can accommodate different package types without requiring conversion kits. The offloading device is designed with adjustable parameters and a universal gripping mechanism that adapts to various package sizes and configurations, eliminating the need for multiple specialized setups while maintaining versatility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8167524B2Handling system for inspecting and sorting electronic components

Publication Date: 2012.05.01 ASM ASSEMBLY AUTOMATION LTD

AI summary

A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.