Semiconductor Package Flow Channels for Uniform Electroless Plating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electroless plating processes in semiconductor packages often result in non-uniform thickness of electroless plating layers due to uneven flow fields, leading to variations in bonding strength and reliability.
Innovation Solution
The semiconductor package design incorporates multiple flow channels and additional inlets/outlets defined by supporting structures, creating a uniform flow field that ensures consistent electroless plating layer thickness across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electroless plating process is used with single flow channel, then device complexity is low, but manufacturing precision of electroless plating layer thickness deteriorates
Solution Approach 1:
The single flow channel is segmented into multiple flow channels (first flow channel, second flow channel, third flow channel) that are spatially distributed across the substrate. Each flow channel has its own inlet and outlet, creating multiple independent flow paths that collectively cover the entire bonding region, thereby achieving uniform plating thickness across different areas of the substrate.
Solution Approach 2:
The flow channel structure transitions from a single linear path to a two-dimensional network distributed across the substrate surface. The multiple flow channels are arranged in different spatial locations (first, second, and third flow channels with different inlet-outlet configurations) to create comprehensive coverage, transforming the problem from one-dimensional flow to multi-dimensional flow distribution.
2Manufacturing precision
If multiple flow channels are introduced to improve plating uniformity, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The supporting structures serve multiple functions: they provide mechanical support for the substrate, define the flow channel paths, create the bonding regions, and establish the spatial arrangement of inlets and outlets. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity while achieving improved plating uniformity.
3Manufacturing precision
If supporting structures are added to define flow channels, then manufacturing precision of plating thickness improves, but device complexity increases
Solution Approach 1:
The supporting structures are merged with the flow channel definition function. The same structural elements that provide mechanical support also serve to define the flow channel paths and create the bonding regions. This integration reduces the total number of discrete components and simplifies the overall device architecture while achieving uniform plating thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the uniformity of electroless plating layers, improving the bonding strength and reliability of semiconductor packages by maintaining consistent thickness and reducing deviations in electroless plating layer formation.
Implementation Method 1
The first flow channel and the second flow channel constitute a bonding region of the first substrate
Implementation Method 2
The electroless plating process has been used in the bonding of die to die or die to wafer. Electroless plating layers are formed to bond conductive pillars or bumps of a top substrate to conductive pillars or bumps of a bottom substrate
Data Source
AI summary
A semiconductor package includes a first substrate, a first flow channel and a second flow channel. The first flow channel is on the first substrate. The second flow channel is on the first substrate and in fluid communication with the first flow channel. The second flow channel is spaced from an inlet and an outlet of the first flow channel. The first flow channel and the second flow channel constitute a bonding region of the first substrate.