Semiconductor Package Substrate with Fluid Channels and Funnel Access
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The proposed solution involves a semiconductor device design with a substrate having a conductive structure, a channel opening, and a funnel, where the electronic component is coupled with the conductive structure, and a fluid channel is defined to facilitate the flow of fluids, enhancing the packaging efficiency and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size becomes too large
Solution Approach 1:
The substrate is segmented into multiple functional regions including a first region with through-substrate vias for electrical connections, a second region with fluid channels for thermal management, and a third region for additional functionality. This segmentation allows compact integration of multiple functions within a smaller package footprint while maintaining manufacturing feasibility through standardized processing steps for each region.
Solution Approach 2:
The invention utilizes vertical dimensionality by creating through-substrate vias that extend completely through the substrate thickness, allowing electrical connections to pass through the package vertically. This three-dimensional routing approach reduces the horizontal package size by moving connections from a planar layout to a volumetric layout, achieving smaller footprint without excessive manufacturing complexity.
2Reliability
If conventional semiconductor packages are used, then design is simpler, but reliability decreases
Solution Approach 1:
The invention merges electrical interconnection functions and thermal management functions into a single integrated substrate structure. The through-substrate vias serve dual purposes as both electrical conductors and structural elements that define fluid channels, eliminating the need for separate components and improving reliability through unified design while managing complexity through functional integration.
Solution Approach 2:
The substrate is designed as a multi-functional component that simultaneously provides mechanical support, electrical interconnection through through-substrate vias, and thermal management through integrated fluid channels. This universal design approach improves reliability by reducing the number of interfacial connections between separate components, while the modular nature of the multi-functional substrate keeps design complexity manageable.
3Productivity
If conventional semiconductor packages are used, then costs are lower, but performance is reduced
Solution Approach 1:
The invention integrates fluid channels directly into the substrate structure, enabling efficient thermal management through liquid cooling. This hydraulic approach removes heat more effectively from high-performance devices compared to conventional air cooling or heat sinks, thereby enabling higher performance operation. The manufacturing cost is managed by forming these fluid channels using standard semiconductor fabrication processes such as etching and deposition, rather than requiring complex external cooling systems.
Data Source
AI summary
In one example, an electronic device comprises a base, a substrate over the base and comprising a top side, a bottom side, and a conductive structure, wherein the substrate further comprises a channel opening and an aperture, and wherein the bottom side of the substrate is oriented toward the base, an electronic component over the top side of the substrate and over the aperture, wherein the electronic component is coupled with the conductive structure, and a funnel over the top side of the substrate and comprising a funnel opening. A top side of the electronic component is exposed through the funnel opening. Other examples and related methods are also disclosed herein.