Semiconductor Package on Fluid Heatsink for High Power Density
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Solution Overview
Problem
Traditional semiconductor power modules require high development efforts and have limited flexibility, making it challenging to increase power density effectively.
Innovation Solution
The electronic module design includes a semiconductor package with a die carrier, semiconductor transistor die, electrical conductors, an encapsulant, an interposer layer, and a fluid heat sink, allowing for flexible configuration and efficient heat dissipation through a cooling medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional semiconductor power modules are constructed on a semiconductor bare die assembly, then the module structure is well-defined, but the development effort increases and flexibility decreases
Solution Approach 1:
The patent segments the semiconductor power module into standardized sub-components (semiconductor packages with specific footprints) that can be independently selected and combined. The die carrier and encapsulant are separated as distinct elements, allowing flexible reconfiguration without redesigning the entire module architecture.
Solution Approach 2:
The patent creates universal mounting structures and standardized electrical conductor arrangements that can accommodate different semiconductor package types and configurations. The same base structure supports various power density requirements and layout arrangements, making the module design universally applicable across different applications.
2Power
If power density is increased in semiconductor modules, then system output power increases, but heat dissipation challenges increase
Solution Approach 1:
The patent introduces an interposer layer or mounting structure as an intermediary between the semiconductor packages and the heat sink. This intermediary provides both mechanical support for high-power density packaging and thermal conduction pathways to efficiently transfer heat away from the concentrated power components.
Solution Approach 2:
The patent employs fluid-based cooling systems (liquid cooling channels or heat pipes) integrated into the module structure to actively remove heat generated by high-power-density semiconductor devices, replacing passive air cooling with more efficient fluid thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces development efforts and enhances flexibility, enabling higher power density and effective heat management, which is crucial for applications like UPS and EV charging systems.
Implementation Method 1
a heat sink through which a cooling medium can flow
Implementation Method 2
the interposer layer is disposed on the heatsink
Data Source
AI summary
An electronic module includes a semiconductor package including a die carrier, a semiconductor transistor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant. The electronic module further includes an interposer layer on which the semiconductor package is disposed, and a heat sink through which a cooling medium can flow. The interposer layer is disposed on the heatsink.