Semiconductor Package Frame Structure for Fine-Pitch Reliability
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Solution Overview
Problem
The existing semiconductor package technologies face challenges in miniaturization and multifunctionalization due to step differences between semiconductor chips and frame structures, leading to reliability issues and increased production costs, particularly in fan-out panel level packages.
Innovation Solution
The semiconductor package design incorporates a frame structure with a core portion, lower and upper pads, and a redistribution structure connected to bump pads, with a molding member surrounding all surfaces to minimize step differences and improve connectivity, using a chip-first manufacturing method to enhance reliability and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional semiconductor package structure is used with a semiconductor chip mounted on a substrate, then the package can accommodate standard chip sizes, but it cannot achieve fine-pitch connections and miniaturization required for high-capacity chips in limited spaces
Solution Approach 1:
The patent transitions from a conventional substrate-mounted chip structure to a chip-first structure where the semiconductor chip is mounted on a frame structure, and the redistribution layer is formed on the back surface of the chip. This dimensional change allows fine-pitch connections to be achieved without increasing the chip footprint area, enabling miniaturization while maintaining connection precision.
Solution Approach 2:
The patent separates the mounting function (frame structure) from the redistribution function (redistribution layer on chip back surface). The frame structure provides mechanical support and initial mounting, while the redistribution layer on the opposite surface of the chip enables fine-pitch interconnections. This segmentation allows independent optimization of both mounting stability and connection precision.
2Device complexity
If the semiconductor chip is directly mounted on the substrate without a frame structure, then the structure is simpler, but step differences cause reliability issues and increased production costs
Solution Approach 1:
The frame structure serves as an intermediary element between the substrate and the semiconductor chip. It provides a stable mounting platform that reduces step differences and improves connection reliability. The frame structure absorbs mechanical stresses and prevents direct contact between the chip and substrate, thereby enhancing reliability without significantly increasing overall device complexity.
3Quantity of substance
If fine-sized electrode pads are used to mount high-capacity chips, then chip capacity increases, but the electrode pad area becomes insufficient for reliable connections
Solution Approach 1:
The patent utilizes the back surface of the semiconductor chip as an additional dimension for forming the redistribution layer. This allows fine-pitch connections to be created on the opposite surface from the mounting face, effectively increasing the available area for high-density interconnections without increasing the chip footprint. This enables high chip capacity with sufficient connection area.
4Manufacturing precision
If a redistribution layer is added to enable fine-pitch connections, then connection precision improves, but manufacturing complexity and production costs increase
Solution Approach 1:
The semiconductor chip is first mounted on the frame structure with standard pitch connections, and then the redistribution layer is formed on the back surface of the chip in a subsequent processing step. This preliminary mounting followed by redistribution layer formation allows the use of existing mounting processes while adding fine-pitch capability through an additional layer, thereby improving connection precision without requiring complete process reconfiguration.
Data Source
AI summary
A semiconductor package includes a frame structure having a core portion and a lower pad under the core portion. A cavity penetrates the core portion, and a semiconductor chip is arranged in the cavity and has an active surface on which a bump pad is arranged and a non-active surface facing the active surface. A redistribution structure is positioned under the frame structure and the semiconductor chip, and is connected to the lower pad and the bump pad. A molding member covers the frame structure and the semiconductor chip and fills the cavity. The molding member surrounds a lower surface of the frame structure, the active surface of the semiconductor chip, the lower pad, and the bump pad.