Semiconductor Package Layout With Stacked FSS Antenna Isolation
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Solution Overview
Problem
Conventional semiconductor packages with Frequency Selective Surface (FSS) antennas on board components occupy a large area due to the integration of FSS antennas and chips on the same surface of the circuit board, leading to space inefficiencies.
Innovation Solution
A semiconductor package design that includes a substrate, an electronic component, a dielectric layer, transmitting and receiving antennas, and a FSS antenna, where the FSS antenna is separated from the substrate by the dielectric layer, allowing for a smaller form factor by embedding a shielding wall within the dielectric layer to reduce electromagnetic interference and signal leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the FSS antenna and chip are disposed on the same surface of the circuit board, then the integration is achieved, but the area of the AoB component becomes large
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement where both the FSS antenna and chip occupy the same surface to a three-dimensional stacked configuration. The FSS antenna is positioned on the upper surface of the circuit board while the chip is mounted on the lower surface, utilizing the vertical dimension (Z-axis) to separate their spatial occupation. This dimensional transition allows both components to be integrated into a single AoB package without increasing the planar area footprint.
2Area of stationary object
If the FSS antenna is separated from the substrate by the dielectric layer, then the form factor is reduced, but electromagnetic interference and signal leakage may occur
Solution Approach 1:
The patent introduces a dielectric layer as an intermediary substance positioned between the FSS antenna on the upper surface and the substrate on the lower surface. This dielectric layer serves multiple functions: it provides electrical isolation to prevent signal leakage, acts as a shielding barrier to reduce electromagnetic interference, and maintains the compact stacked geometry. The dielectric material's inherent insulating properties enable the separation of components while protecting against harmful electromagnetic interactions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact size in the XY direction while maintaining effective wireless signal transmission and reception, and provides shielding to prevent electromagnetic interference, thus enhancing the package's efficiency and performance.
Implementation Method 1
The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction
Implementation Method 2
A shielding wall is embedded in the dielectric layer and extending between a dielectric lower surface of the dielectric layer and the dielectric upper surface of the dielectric layer
Implementation Method 3
The dielectric layer comprises a dielectric portion surrounding a resonant cavity within which the electronic component is disposed and exposed
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.