Semiconductor Package Structure with Inter-Device Gap and Stress Buffer
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Solution Overview
Problem
Semiconductor package structures experience warpage and cracking during thermal processes due to low rigidity, leading to potential damage of circuit layers and decreased yield.
Innovation Solution
A package structure with a wiring structure, first and second electronic devices, and a protection material where the second electronic device is spaced apart from the first electronic device by a gap greater than or equal to 150 μm, with the protection material filling the gap to reduce stress concentration and enhance crack resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic devices are disposed closely side by side to increase integration, then device density is improved, but warpage and cracking occur during thermal process due to stress concentration
Solution Approach 1:
The patent introduces a gap between adjacent electronic devices, effectively segmenting the continuous stress path that would otherwise connect them. This segmentation prevents stress concentration from propagating across device boundaries during thermal processing, thereby reducing crack formation while maintaining high device density through optimized spacing
Solution Approach 2:
The protection material serves as an intermediary substance filling the gap between electronic devices. It absorbs and distributes thermal stress, preventing direct stress transmission between adjacent devices. The protection material acts as a buffer that maintains device integrity during thermal processes while allowing close spacing for high integration
2Reliability
If protection material is applied to fill gaps between devices, then crack resistance is improved, but manufacturing complexity increases due to additional coating steps
Solution Approach 1:
The patent combines the gap-filling protection material application with existing manufacturing processes. The protection material is applied as electronic devices are being assembled or positioned, merging the protective coating step with the device placement operation. This integration reduces the number of separate manufacturing steps while ensuring proper gap filling for crack prevention
Data Source
AI summary
A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The first electronic device and the second electronic device are disposed side by side. A gap between the first electronic device and the second electronic device is greater than or equal to about 150 μm.