Semiconductor Package Lid Structure for Multi-Sensor Gas Pathways
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Solution Overview
Problem
Conventional semiconductor packages for gas flow detection systems are bulky due to the separate manufacturing of different types of sensors, which increases the overall size of the system.
Innovation Solution
A semiconductor package design that integrates a carrier, a lid structure with a gas inlet and outlet, and multiple dies within the same cavity, utilizing protrusion patterns to define separate pathways for different types of sensors, allowing for compact integration of various sensor applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different types of sensors are manufactured separately, then each sensor can be optimized for its specific function, but the overall system size becomes bulky
Solution Approach 1:
The patent combines multiple sensor types (gas flow rate sensor, gas species sensor, and temperature sensor) into a single integrated semiconductor package. The carrier structure integrates multiple dies, each containing different sensor types, within one unified package with shared inlet/outlet channels, eliminating the need for separate sensor housings and reducing overall system volume while maintaining individual sensor optimization.
Solution Approach 2:
The semiconductor package is designed as a multi-functional integration platform where a single package housing accommodates multiple sensor functions. The lid structure with integrated pathways serves multiple purposes: guiding gas flow to different sensor types, providing structural support, and enabling compact arrangement of multiple sensing elements within the same physical envelope.
2Volume of moving object
If multiple sensor types are integrated within a single cavity, then the system size is reduced, but the pathway design becomes more complex
Solution Approach 1:
The lid structure is divided into multiple protrusion patterns that segment the internal cavity into distinct pathways. Each protrusion pattern creates separated flow channels that guide gas to specific sensor dies, simplifying the pathway design by using modular geometric features rather than complex continuous structures. This segmentation approach enables clear differentiation of flow paths while maintaining compact integration.
3Measurement precision
If protrusion patterns are used to define separate pathways, then gas flow can be precisely directed to different sensors, but manufacturing precision requirements increase
Solution Approach 1:
The protrusion patterns are designed with differentiated local geometries optimized for their specific functions. Each protrusion pattern's dimensions, heights, and positions are locally tailored to create appropriate flow resistance and direction for its associated sensor type, rather than using uniform structures throughout. This local optimization allows precise flow control while accommodating manufacturing tolerances through function-specific design adjustments.
Data Source
AI summary
A semiconductor package and a lid structure are disclosed. The semiconductor package includes a carrier, a lid structure, a first die, and a second die. The lid structure is disposed over the carrier and includes a gas inlet and a gas outlet. The first die is disposed over the carrier. The second die is disposed over the carrier. The lid structure includes a first protrusion pattern protruding toward the carrier and extending between the first die and the second die.