Semiconductor Package Assembly With Compressible Gasket for Heat Dissipation
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Solution Overview
Problem
The challenge of heat dissipation in miniaturized semiconductor packages has become critical as electronic products continue to shrink, necessitating improved packaging technologies that can manage thermal management effectively.
Innovation Solution
A package system comprising a semiconductor package with a redistribution structure and a mechanical structure that includes a base plate with a thermal interface material, a brace, and a gasket, which together facilitate efficient heat dissipation through a fan-out design and secure assembly using fasteners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are miniaturized to reduce electronic product size, then footprint is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from two-dimensional planar packaging to three-dimensional vertical stacking by implementing fan-out wafer-level packaging with multiple packaging units stacked in the thickness direction. This dimensional change allows heat to be dissipated through multiple surfaces and pathways, effectively managing thermal issues in miniaturized packages.
Solution Approach 2:
The semiconductor package is divided into multiple discrete packaging units, each containing separate semiconductor components. This segmentation allows independent thermal management for each unit and enables distributed heat dissipation across the entire package structure, addressing the heat dissipation challenge in compact designs.
2Area of stationary object
If packaging units are stacked in the thickness direction to reduce footprint, then area is reduced, but pressure equalization becomes difficult due to height variations
Solution Approach 1:
A compressible gasket is introduced as a flexible element between the stacked packaging units. This gasket deforms to accommodate height variations in the stacked components, ensuring uniform pressure distribution across all interfaces while maintaining compact vertical stacking for reduced footprint.
Solution Approach 2:
The gasket material properties are selected to provide compressibility and elasticity, allowing it to change its thickness parameter in response to varying component heights. This parameter change enables the system to maintain pressure equalization despite variations in the stacked packaging unit dimensions.
3Temperature
If thermal interface material is applied to the base plate to improve heat dissipation, then thermal management is enhanced, but manufacturing complexity increases
Solution Approach 1:
The thermal interface material is pre-applied to the base plate before assembling the stacked packaging units. This preliminary action simplifies the manufacturing process by eliminating the need for complex in-situ thermal material application equipment and procedures, while still achieving effective thermal management.
Solution Approach 2:
The base plate serves multiple functions: it provides mechanical support for the stacked packaging units and simultaneously acts as a heat sink with pre-applied thermal interface material. This multi-functionality reduces manufacturing complexity by combining structural and thermal management roles in a single component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat dissipation and ensures secure assembly, even with varying package component heights, by utilizing a compressible gasket to equalize pressure and a thermally conductive base plate for efficient thermal management.
Implementation Method 1
a base plate with a thermal interface material
Implementation Method 2
utilizing a compressible gasket to equalize pressure
Data Source
AI summary
A package system includes a semiconductor package and a mechanical structure. The mechanical structure includes a first plate secured to the semiconductor package and a gasket interposed between the first plate and the semiconductor package. The gasket is deformed following a topography of a first surface of the semiconductor package.