Semiconductor Package With Graphite Block Copolymer Film
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Solution Overview
Problem
As semiconductor packages integrate multiple chips to achieve high-capacity and miniaturization, they generate significant heat, leading to performance deterioration due to inefficient heat dissipation.
Innovation Solution
Incorporating a block copolymer film with different patterns, one containing graphite, to enhance heat dissipation by facilitating the release of heat generated within the semiconductor package, potentially omitting the need for a heat slug and reducing package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are integrated into one semiconductor package to achieve high-capacity and miniaturization, then the capacity and functionality of the semiconductor package are improved, but significant heat is generated leading to performance deterioration
Solution Approach 1:
The patent applies local quality by creating different patterns within the block copolymer film - some regions contain graphite particles for heat dissipation while other regions have different properties. This is achieved through selective formation conditions that create spatially differentiated zones with tailored thermal and functional characteristics, allowing simultaneous optimization of heat management and device functionality in different areas of the package.
Solution Approach 2:
The patent uses composite materials by forming a block copolymer film containing graphite particles dispersed within the polymer matrix. This composite structure combines the adhesive and protective properties of the block copolymer with the high thermal conductivity of graphite, creating a material that simultaneously addresses bonding requirements and heat dissipation needs in the integrated semiconductor package.
2Temperature
If a block copolymer film with graphite is used to enhance heat dissipation, then heat dissipation efficiency is improved, but the package thickness may be reduced which could affect structural integrity
Solution Approach 1:
The patent applies parameter changes by controlling the formation conditions of the block copolymer film - including temperature, time, and chemical composition - to optimize both the thermal properties and mechanical strength. By adjusting these parameters, the film achieves enhanced heat dissipation through graphite incorporation while maintaining sufficient thickness and structural integrity for the application.
3Adaptability or versatility
If different patterns are formed in the block copolymer film, then functional differentiation is achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies preliminary action by incorporating the pattern differentiation step into the existing block copolymer film formation process. Rather than adding separate complex patterning steps after film deposition, the different patterns are created during the initial film formation through controlled variation in processing conditions, thereby achieving functional differentiation with minimal additional manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The block copolymer film with graphite improves heat dissipation efficiency, maintaining or improving the reliability and operation performance of semiconductor packages while potentially reducing their thickness.
Implementation Method 1
One of the first pattern and the second pattern contains graphite. The block copolymer film with graphite improves heat dissipation efficiency
Data Source
AI summary
A semiconductor package provided. The semiconductor package includes an interposer layer including a first surface and a second surface opposing each other, a first semiconductor chip and a second semiconductor chip on the first surface of the interposer layer, and a block copolymer film on the first semiconductor chip and the second semiconductor chip. The first semiconductor chip and the second semiconductor chip are different from each other. The block copolymer film includes a first pattern and a second pattern, which are different from each other, and one of the first pattern and the second pattern contains graphite.