Semiconductor Package Groove Design for Stack Reliability
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Solution Overview
Problem
In stack package structures, the electrical connection between a substrate and larger upper semiconductor chips is often compromised due to space constraints under the periphery of the upper chips, leading to degraded electrical characteristics and reliability.
Innovation Solution
A semiconductor package design featuring a body with a groove to accommodate a lower device, allowing for improved electrical connection through various connection parts and members, enabling stable stacking and connection of larger upper devices, and including a molding member for encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If larger upper semiconductor chips are stacked on a smaller lower semiconductor chip, then the capacity and mounting efficiency are improved, but the electrical connection between the upper chips and the substrate deteriorates due to space constraints under the periphery
Solution Approach 1:
The connection path is segmented into two independent routes: first connection parts extend from the first surface to the second surface for direct electrical connection, while second connection parts extend from the groove bottom to the second surface for indirect connection through the lower device. This segmentation allows larger upper chips to be mounted without compromising electrical connection reliability.
Solution Approach 2:
The lower semiconductor chip acts as an intermediary element that provides additional connection pathways. The second connection parts connect to the lower device, which then connects to the substrate, creating a mediated electrical connection route that bypasses the space constraints under the upper chip periphery.
2Reliability
If multiple connection parts are formed to improve electrical connection, then the electrical characteristics are improved, but the device complexity increases
Solution Approach 1:
The body structure serves multiple functions simultaneously: it provides mechanical support, houses the groove for the lower device, and contains both first and second connection parts for electrical connection. This multi-functionality reduces the need for separate dedicated structures for each function.
Solution Approach 2:
The first and second connection parts are integrated into a unified connection structure within the body. The connection parts are formed as through vias that extend through the body, combining the mechanical and electrical functions in a single integrated structure rather than separate components.
Data Source
AI summary
A semiconductor package includes a body having a first surface and a second surface facing away from the first surface, and formed with a groove in the first surface. First connection parts may electrically connect a portion of the first surface to a portion of the second surface of the body. Second connection parts may electrically connect a portion of a bottom portion of the groove to a portion of the second surface of the body. A lower device may be disposed in the groove of the body, and have third connection parts that are electrically connected with the second connection parts. An upper device may be disposed on the body and the lower device, and have fourth connection parts that are electrically connected with the first connection parts and the third connection parts.