Semiconductor Package Insulation Layout Using Cooling Plate Groove
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increase in the area of the insulating layer leads to an increase in the size of the semiconductor package, as it protrudes from the heat spreader, necessitating a larger cooling plate.
Innovation Solution
A semiconductor package design with a groove on the cooling plate beneath the heat spreader, where the insulating layer overhangs the groove, ensuring insulation without protrusion, thus maintaining a smaller package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the area of the insulating layer is increased to ensure insulation distance, then insulation reliability is improved, but the size of the semiconductor package increases
Solution Approach 1:
The patent transitions from a two-dimensional planar insulation approach to a three-dimensional structure by forming a groove in the cooling plate and having the insulating layer overhang the groove. This vertical dimensionality change allows the insulating layer to provide sufficient insulation distance without increasing the horizontal package area, as the groove provides additional insulation path length in the vertical direction.
Solution Approach 2:
The insulating layer is positioned to overhang the groove formed in the cooling plate, creating a nested configuration where the insulating layer extends into the groove region. This nesting arrangement maximizes the insulation distance within the available vertical space without requiring additional horizontal area, thereby resolving the contradiction between insulation reliability and package size.
2Reliability
If the insulating layer protrudes from the heat spreader to ensure insulation distance, then insulation is improved, but the cooling plate area must increase
Solution Approach 1:
Instead of increasing the horizontal protrusion of the insulating layer beyond the heat spreader, the patent utilizes the vertical dimension by forming a groove in the cooling plate. The insulating layer overhangs this groove, creating sufficient insulation distance in the vertical direction while maintaining alignment with the heat spreader's horizontal boundaries, thus avoiding increased cooling plate area.
Solution Approach 2:
The groove is formed locally in the cooling plate at the specific region beneath the heat spreader, creating a localized structural feature that enhances insulation distance only where needed. This localized modification allows the insulating layer to achieve sufficient insulation performance without requiring a universal increase in cooling plate dimensions.
Data Source
AI summary
A heat spreader (3) is provided on an upper surface of a cooling plate (1) with an insulating layer (2) interposed therebetween. A semiconductor chip (4) is provided on the heat spreader (3). Mold resin (10) seals the upper surface of the cooling plate (1), the heat spreader (3), and the semiconductor chip (4). The insulating layer (2) does not protrude from the heat spreader (3) to a side of the heat spreader (3). A groove (11) is provided on the upper surface of the cooling plate (1) below a peripheral portion of the heat spreader (3). The insulating layer (2) is provided to overhang the groove (11).