Semiconductor Package Groove Interlock for Thin Stable Wafer Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current multilayer stack packaging technologies face challenges in reducing thickness and ensuring stable connections between wafers due to the use of non-conduction paste, which leads to increased thickness and potential short circuits and misalignment, failing to meet the requirements for thinner terminals and stable signal transfer.
Innovation Solution
A semiconductor structure design where the electrical connection structure and a portion of the electrical connection pillar are embedded into a groove of the first base, enhancing stability and contact areas, eliminating the need for additional non-conduction paste, and reducing overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If non-conduction paste is used for connection between wafers, then electrical insulation is achieved, but the overall thickness of the multilayer stack structure is increased
Solution Approach 1:
The patent removes the non-conduction paste layer from the multilayer stack structure and replaces it with a groove-based mechanical interlocking system. The groove is formed directly in the wafer surface, eliminating the need for additional insulating material while maintaining electrical insulation through the groove geometry and surrounding conductive structures.
Solution Approach 2:
The invention transitions from a vertical stacking approach with paste layers to a horizontal groove-based connection system. The groove extends laterally into the wafer surface, providing mechanical interlocking and electrical insulation through the groove's three-dimensional geometry rather than through an additional vertical paste layer.
2Productivity
If connection structure dimension is reduced for integration, then device miniaturization is achieved, but short circuits between adjacent connection structures occur
Solution Approach 1:
The patent applies different properties to different regions: the groove provides mechanical interlocking and lateral separation, while the surrounding conductive structures provide electrical connection. This localized functional differentiation allows reduced connection structure dimensions without compromising short circuit prevention, as each region performs its specific function optimally.
Solution Approach 2:
The connection structure is segmented into distinct functional zones: the groove region for mechanical interlocking and lateral isolation, and the conductive pillar regions for electrical connection. This segmentation allows each component to be optimized independently, enabling miniaturization while maintaining reliability through the groove's lateral separation function.
3Productivity
If connection structure dimension is reduced for integration, then device miniaturization is achieved, but peeling between wafers occurs
Solution Approach 1:
The groove is nested directly into the wafer surface, creating an interlocking structure where the groove walls engage with corresponding features in the stacked wafer. This nested geometry provides mechanical reinforcement that prevents peeling forces from separating the wafers, while the groove's compact footprint enables miniaturization.
Solution Approach 2:
The groove's curved or tapered geometry distributes mechanical stresses more evenly across the wafer interface, preventing stress concentration that would lead to peeling. The curved walls of the groove provide gradual load transfer, enhancing bonding stability despite reduced connection structure dimensions.
4Reliability
If additional non-conduction paste is used for connection, then electrical insulation is ensured, but material consumption and thickness increase
Solution Approach 1:
The patent extracts and eliminates the non-conduction paste material from the connection structure, replacing its insulating function with the groove geometry itself. The groove walls and surrounding conductive structures provide the necessary electrical insulation without requiring additional insulating materials, thereby reducing material consumption.
Solution Approach 2:
The groove structure serves multiple functions simultaneously: it provides mechanical interlocking, lateral separation for insulation, and stress distribution. The existing wafer material forming the groove walls provides the insulation function that would otherwise require separate paste material, making the structure self-sufficient and reducing overall material consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the stability and signal transfer efficiency between bases while minimizing material consumption and thickness, preventing sliding and short circuits, and ensuring precise alignment.
Implementation Method 1
the first surface is bonded to the second surface
Data Source
AI summary
A semiconductor structure and a method for manufacturing a semiconductor structure are provided. The semiconductor structure includes: a first base with a first surface, in which a conductive pillar is arranged in the first base, the first surface includes a first groove, and the first groove exposes a top surface and a portion of a sidewall of the conductive pillar; a second base with a second surface, in which the first surface is bonded to the second surface, the second surface includes a second groove, an electrical connection pillar is arranged in the second base, the electrical connection pillar is located in the second groove, and the electrical connection pillar protrudes from the second surface; and an electrical connection structure, in which the electrical connection structure and a portion of the electrical connection pillar are embedded into the first groove.