Semiconductor Package Groove Underfill Filling

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Solution Overview

Problem

The existing semiconductor packages face challenges in forming a uniform underfill material layer between the substrate and the semiconductor device due to the narrow space and weak adhesion between the underfill material and the substrate, leading to incomplete filling and potential mechanical stress.

Innovation Solution

The semiconductor package incorporates grooves on the substrate with distinct regions, where the underfill material is easily filled by exploiting the capillary effect and enhanced adhesion along the groove's surfaces, allowing the material to flow from exposed to hidden regions and fill the narrow space between the substrate and the semiconductor device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the space between the substrate and the semiconductor device is narrow, then the package size is reduced, but the underfill material layer cannot be fully formed

Engineering Contradiction:

Improvepackage sizeVSAvoidunderfill material layer formation

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The substrate surface is divided into multiple regions by forming grooves that extend from the edge toward the center. These grooves segment the surface into a first region (where the semiconductor device is mounted) and a second region (exposed region), creating pathways for underfill material to flow into the narrow space between the substrate and the semiconductor device, thereby enabling complete filling while maintaining compact dimensions.

Inventive Principle:

Principle #1Segmentation

2Strength

If the groove structure is added to the substrate, then the underfill material adhesion is enhanced, but the substrate manufacturing complexity increases

Engineering Contradiction:

Improveunderfill material adhesionVSAvoidsubstrate structure

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The groove structure creates a porous-like surface topology on the substrate. These grooves provide increased surface area and capillary channels that enhance the adhesion of the underfill material to the substrate while maintaining a relatively simple manufacturing process through conventional patterning and etching techniques.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a fully filled underfill material layer, reducing mechanical stress and improving connection reliability between the substrate and the semiconductor device, while controlling the flow and distribution of the underfill material effectively.

Implementation Method 1

the underfill material is easily filled by exploiting the capillary effect and enhanced adhesion along the groove's surfaces

Methodology Applied

Scientific EffectCapillary effect: Capillary Action

Implementation Method 2

the underfill material is easily filled by exploiting the capillary effect and enhanced adhesion along the groove's surfaces

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9786624B2Semiconductor package

Publication Date: 2017.10.10 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes a substrate having a groove in an upper surface. A semiconductor device is mounted on the substrate to cover one portion of the groove and leaving another portion exposed.