Semiconductor Package Grooves for Heat Dissipation and Insulation

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Solution Overview

Problem

In semiconductor packages, the non-exposure of lead terminals from the package lower surface hinders effective heat radiation and insulation resistance, leading to increased temperature and reduced current density, especially when multiple lead terminals and die pads are adjacent, making it difficult to secure necessary insulation resistance.

Innovation Solution

The semiconductor package design exposes both die pads and lead terminals from the lower surface with grooves between them, allowing for improved heat radiation and securing creepage distances to ensure necessary insulation resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If lead terminals are not exposed from the package lower surface to secure insulation distance, then insulation resistance is improved, but heat radiation capability deteriorates

Engineering Contradiction:

Improveinsulation resistanceVSAvoidheat radiation capability

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The package lower surface is segmented into multiple regions: exposed lead terminals for heat radiation, grooves for insulation spacing, and exposed die pads for additional heat radiation. This segmentation allows simultaneous optimization of heat dissipation and insulation by physically separating functional zones.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the package lower surface are given different properties: lead terminals are exposed at specific locations for heat radiation, grooves are positioned between adjacent terminals to provide insulation, and die pads are exposed where heat dissipation is needed. Each local region is optimized for its specific function.

Inventive Principle:

Principle #3Local quality

2Temperature

If multiple lead terminals are exposed on the package lower surface to improve heat radiation, then heat radiation capability is improved, but insulation distance among terminals deteriorates

Engineering Contradiction:

Improveheat radiation capabilityVSAvoidinsulation resistance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

Grooves are introduced as segmentation elements between adjacent lead terminals on the exposed lower surface. These grooves create physical separation that maintains insulation distance while allowing both terminals to remain exposed for heat radiation purposes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The grooves act as intermediary structures between adjacent lead terminals. They provide the necessary insulation spacing without preventing the terminals from being exposed, thus mediating between the conflicting requirements of heat radiation and insulation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Power

If electric current is increased to improve power output, then power output is improved, but temperature of lead terminal exceeds allowable value

Engineering Contradiction:

Improvepower outputVSAvoidlead terminal temperature

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

Heat radiation structures (exposed lead terminals and die pads) are prepared in advance on the package lower surface, creating preliminary heat dissipation pathways before high current operation. This preliminary preparation of thermal management structures prevents temperature exceedance during high power operation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Heat dissipation is extended to the lower surface dimension by exposing lead terminals and die pads downward. This adds a third dimension (vertical heat radiation from lower surface) to the thermal management strategy, increasing overall heat dissipation capacity to support higher current operation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat radiation and insulation resistance by allowing direct heat dissipation and securing adequate creepage distances between exposed components, thereby supporting higher current densities and reliable insulation.

Implementation Method 1

Heat generated in the lead terminal when an electric current is fed is radiated into the air

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS11798869B2Semiconductor package with plurality of grooves on lower surface

Publication Date: 2023.10.24 MITSUBISHI ELECTRIC CORP

AI summary

A semiconductor package includes: a plurality of die pads; a plurality of semiconductor chips provided on the plurality of die pads respectively; a plurality of lead terminals connected to the plurality of semiconductor chips respectively; and a package sealing the plurality of die pads, the plurality of semiconductor chips, and the plurality of lead terminals, the plurality of die pads and the plurality of lead terminals are exposed from a lower surface of the package, and on the lower surface of the package, grooves are provided among the die pads adjacent to one another and among the lead terminals adjacent to one another.