Semiconductor Package Grooves to Prevent Molding Layer Peeling
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Solution Overview
Problem
The peeling of the molding layer from electronic components in semiconductor packages due to external stress or force leads to deterioration of the electronic components and potential short circuits between electrodes.
Innovation Solution
Incorporating grooves with varying widths in the electronic components, where the width increases from the entrance to the bottom, and filling these grooves with a molding layer to enhance contact area and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molding layer is applied to protect electronic components, then the electronic components are protected, but the molding layer peels off from the electronic component when stress or force is applied from outside
Solution Approach 1:
The electronic component surface is segmented into multiple grooves that divide the molding layer into separate regions. This segmentation increases the total surface area for adhesion and prevents peeling by distributing stress across multiple small interfaces rather than one large interface.
Solution Approach 2:
The grooves create local variations in the electronic component surface, providing specific locations with enhanced adhesion properties. The molding layer fills these grooves to create localized bonding zones that are more resistant to peeling forces.
2Reliability
If the molding layer is made to adhere strongly to the electronic component, then peeling is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The grooves are formed on the electronic component surface before the molding layer is applied. This preliminary structuring of the surface enables enhanced adhesion without requiring complex manufacturing processes during the molding stage, as the grooves are created in advance using standard semiconductor fabrication techniques.
3Stability of the object's composition
If grooves are added to the electronic component to prevent peeling, then adhesion is improved, but the electronic component structure becomes more complex
Solution Approach 1:
The grooves have specific dimensional parameters (width, depth, spacing) that are optimized to provide effective adhesion enhancement. By carefully controlling these parameters, the structure achieves improved bonding without excessive complexity, as the grooves can be formed using standard photolithography and etching processes with appropriate design rules.
Data Source
AI summary
A semiconductor package includes: a semiconductor chip and an electronic component mounted on a substrate; and a molding layer disposed on the substrate and covering the semiconductor chip and the electronic component, wherein the electron component includes a plurality of grooves, wherein the plurality of grooves are disposed on a surface of the electronic component, wherein the plurality of grooves have a first width at an entrance portion of the plurality of grooves and a second width greater than the first width below the entrance portion, and wherein the molding layer is disposed in the plurality of grooves.