Semiconductor Package EMI Shielding via Ground Layer Segmentation
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Solution Overview
Problem
Semiconductor packages face challenges in reducing electromagnetic interference (EMI) and achieving reliable processing due to the lack of effective EMI blocking structures, which affects the integration of multiple components in a single package and the miniaturization of electronic devices.
Innovation Solution
A semiconductor package design incorporating a frame with through-holes, redistribution layers, and multiple metal pattern layers misaligned in the stack direction, which are electrically connected to the wiring layers and a metal layer, to form an EMI blocking structure that reduces radiation paths and burr formation during the sawing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are mounted in a single package to achieve miniaturization, then device integration is improved, but electromagnetic interference between components increases
Solution Approach 1:
The package structure is segmented into multiple functional layers including signal layers, ground layers, and power layers. The ground layers are strategically positioned between signal layers to create electromagnetic shielding zones, effectively segmenting the electromagnetic fields of different components while maintaining compact integration.
Solution Approach 2:
Ground layers and via structures serve as intermediary elements between different signal components. These intermediary ground planes act as electromagnetic barriers that isolate adjacent signal traces and components, preventing direct electromagnetic coupling while allowing physical proximity for miniaturization.
2Weight of moving object
If metal layers are removed or reduced to decrease weight, then device weight is reduced, but electromagnetic wave radiation increases
Solution Approach 1:
Instead of uniformly distributing metal layers throughout the package, ground metal layers are strategically placed only in critical areas where electromagnetic shielding is most needed. This localized approach provides effective EMI protection while minimizing the total metal content and overall package weight.
Solution Approach 2:
The patent optimizes the thickness, conductivity, and positioning parameters of metal layers to achieve the minimum effective shielding. By carefully controlling these parameters, the design maintains electromagnetic protection performance while reducing metal material usage and package weight.
3Object-affected harmful factors
If complex EMI blocking structures are added to reduce electromagnetic interference, then electromagnetic shielding is improved, but manufacturing complexity increases
Solution Approach 1:
The via structures serve multiple functions: they provide electrical connection between layers, act as electromagnetic shielding elements, and serve as mechanical support points. This multi-functionality reduces the need for separate dedicated shielding structures, simplifying the overall manufacturing process while maintaining effective EMI protection.
Solution Approach 2:
The package employs a nested layer structure where ground layers are positioned between signal layers, creating concentric electromagnetic shielding zones. This nested arrangement provides comprehensive EMI protection through multiple layers of shielding without requiring additional external shielding structures, thereby simplifying manufacturing.
4Object-affected harmful factors
If additional EMI blocking structures are incorporated to improve electromagnetic interference blocking, then electromagnetic shielding is improved, but process reliability may be affected
Solution Approach 1:
Ground layers and via structures are integrated into the package fabrication process from the beginning, rather than being added as post-processing steps. This preliminary integration ensures that EMI shielding structures are properly formed and connected during standard manufacturing processes, avoiding additional reliability risks associated with later modifications.
Data Source
AI summary
A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.