Semiconductor Package Ground Pattern Layout for Crosstalk Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging technologies face challenges in reducing cross talk between adjacent signal conductive patterns and achieving a low height, particularly in miniaturized semiconductor devices.
Innovation Solution
A semiconductor package design featuring an insulation substrate with strategically placed ground and signal conductive patterns, covered by insulation films and conductive members that electrically connect the patterns, reducing electromagnetic interference and allowing for a compact, low-height structure without the need for multi-layered printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multi-layered printed circuit boards are used to reduce cross talk, then signal interference is reduced, but device height increases
Solution Approach 1:
The patent transitions from a multi-layered vertical structure to a planar single-layer structure by introducing ground conductive patterns and insulation films within the same plane. The first and second ground conductive patterns are arranged laterally with signal conductive patterns between them, eliminating the need for vertical layering while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The patent introduces insulation films as intermediary elements between signal conductive patterns and ground conductive patterns. These insulation films mediate the electromagnetic interaction by providing controlled isolation and shielding, reducing cross talk without requiring increased vertical distance between conductive elements.
2Length of stationary object
If ground conductive patterns are placed close to signal patterns to reduce height, then package size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The insulation films are formed beforehand on the substrate before the ground conductive patterns are deposited. This preliminary formation of the insulation layer establishes a predetermined spacing and alignment reference, thereby reducing the precision requirements for subsequent ground pattern fabrication and lowering overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively minimizes cross talk between signal conductive patterns and enables a relatively low-height semiconductor package, improving performance and reducing the complexity of the packaging process.
Implementation Method 1
The first conductive member may further contact the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern to electrically connect the first and second ground conductive patterns
Data Source
AI summary
Provided is a semiconductor package. The semiconductor package includes an insulation substrate with top and bottom surfaces. The semiconductor package further includes a circuit pattern on the top surface. The circuit pattern includes a first signal conductive pattern and first and second ground conductive patterns. The semiconductor package includes a first insulation film covering the first signal conductive pattern and exposing a first portion of the first ground conductive pattern and a portion of the second ground conductive pattern. The semiconductor package further includes a first conductive member on the first signal conductive pattern and the first and second ground conductive patterns. The first conductive member electrically connects the first and second ground conductive patterns by covering a portion of the first insulation film and coming in contact with the first portion of the first ground conductive pattern and the portion of the second ground conductive pattern.