Semiconductor Package EMI Reduction via Grounded Leads and Nested Structure
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Solution Overview
Problem
Conventional semiconductor packages face challenges in achieving a compact, lightweight, and thin design while effectively reducing external electromagnetic interference (EMI) and preventing warpage due to thermal expansion differences.
Innovation Solution
A semiconductor package design featuring a first package with a circuit board and a first semiconductor die, bonded to a second package with a mounting board and leads electrically connected to the mounting board and second semiconductor die, where the leads are grounded to reduce EMI, and an encapsulant surrounds both packages to protect and align components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional semiconductor package designs are used, then electromagnetic interference (EMI) protection is provided, but the package size, weight, and thickness cannot be reduced
Solution Approach 1:
The package is divided into a first package and a second package that are bonded together, with each package serving specific functions. This segmentation allows for optimized EMI protection in the first package while minimizing overall weight through selective material usage and functional distribution.
Solution Approach 2:
The second package is positioned to surround portions of the first package, creating a nested configuration where the leads of the second package extend through openings in the first package. This nested structure provides EMI shielding while minimizing material usage and overall package weight.
2Object-affected harmful factors
If conventional semiconductor package designs are used, then EMI protection is provided, but the package becomes larger and thicker
Solution Approach 1:
The package structure transitions from a conventional single-layer design to a three-dimensional nested configuration, where the second package surrounds portions of the first package and leads extend through openings. This dimensional change provides EMI protection in multiple directions while minimizing overall volume.
Solution Approach 2:
The nested configuration of the second package surrounding the first package allows for compact integration of EMI shielding elements within the minimal possible volume, eliminating the need for separate shielding structures that would increase package size.
3Weight of moving object
If materials with different thermal expansion coefficients are used to reduce weight, then package warpage occurs due to thermal stress
Solution Approach 1:
The bonding structure is designed with localized features including bonding pads and openings positioned at specific locations to manage thermal stress distribution. This local quality approach allows different materials to be used for weight reduction while maintaining overall structural stability through strategic stress management at critical locations.
Solution Approach 2:
The bonding structure acts as an intermediary between materials with different thermal expansion coefficients, providing a transition zone that manages thermal stress. The bonding pads and surrounding structure serve as mediators that accommodate differential expansion while maintaining package flatness.
4Volume of moving object
If a compact package design is used, then weight and size are reduced, but EMI protection effectiveness is compromised
Solution Approach 1:
EMI protection is segmented between the first package and the second package, with each providing shielding in different regions and directions. This segmentation allows compact integration of EMI protection functions without requiring a single large shielding structure.
Solution Approach 2:
The nested three-dimensional configuration provides EMI shielding in multiple spatial dimensions within a compact volume, eliminating the need for extensive single-layer shielding that would increase package size.
5Object-affected harmful factors
If leads are extended to provide electrical connections, then EMI protection is enhanced, but the package becomes more complex
Solution Approach 1:
The leads of the second package serve multiple functions: providing electrical connections between the first and second packages, extending through openings to maintain structural integrity, and contributing to EMI protection by forming part of the nested shielding structure. This multi-functionality reduces overall package complexity.
Solution Approach 2:
The electrical connection function and EMI protection function are merged into the same leads structure, eliminating the need for separate shielding elements and simplifying the overall package design while maintaining both functions.
Data Source
AI summary
A semiconductor package includes a first package comprising a circuit board and a first semiconductor die mounded on the circuit board, and a second package comprising a mounting board. At least one second semiconductor die may be mounted on the mounting board, and one or more leads may be electrically connected to the mounting board and/or the second semiconductor die. An adhesion member may bond the first package to the second package, and an encapsulant may encapsulate the first package and the second package. the circuit board, the mounting board, and the one or more leads may be arranged to surround the first semiconductor die and the second semiconductor die, and the plurality of leads may be electrically connected to the circuit board and to a constant potential or ground, to reduce the effects of external electromagnetic interference upon the semiconductor package.