Semiconductor Package Heat Dissipation Block for Load-Dump Reliability
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Solution Overview
Problem
Existing discrete semiconductor packages suffer from lower performance and reliability, as well as inadequate heat dissipation, particularly in high-power systems and environments subject to transient voltage events.
Innovation Solution
A discrete semiconductor packaging structure featuring a housing, a chip assembly pad, a clip with terminals, a chip linker, and a heat dissipation block configured to remove heat from the semiconductor chip, utilizing conductive materials like copper or copper alloys for enhanced heat absorption and moisture removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging structures are used, then device simplicity is maintained, but heat dissipation performance deteriorates
Solution Approach 1:
The packaging structure is divided into distinct functional segments: a body portion containing the semiconductor die, a separate heat dissipation block coupled to the die, and a molding compound encapsulating both. This segmentation allows each component to be optimized independently for its specific function while maintaining overall structural integrity and heat dissipation efficiency.
Solution Approach 2:
The heat dissipation block serves multiple functions simultaneously: it acts as a thermal management component for heat dissipation, provides mechanical support for mounting the semiconductor die, and serves as an electrical connection element through its conductive material composition. This multi-functionality reduces the need for additional separate components.
2Reliability
If conventional packaging structures are used, then manufacturing simplicity is maintained, but reliability deteriorates
Solution Approach 1:
The heat dissipation block is pre-coupled to the semiconductor die before the final encapsulation process. This preliminary action ensures proper thermal and electrical connections are established early in the manufacturing sequence, improving reliability by preventing connection failures that might occur if coupling were attempted after encapsulation.
Solution Approach 2:
The packaging structure employs composite material construction, combining conductive materials (for the heat dissipation block) with insulating molding compound. This composite approach allows simultaneous achievement of thermal conduction paths and electrical isolation where needed, enhancing reliability without requiring complex multi-step manufacturing processes.
3Power
If conventional packaging structures are used, then structural simplicity is maintained, but heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation block is positioned in direct thermal contact with the semiconductor die at the critical heat-generating location. The conductive material is strategically placed where thermal management is most needed, creating a localized high-performance heat dissipation path without requiring the entire package structure to be complex or heavily material-intensive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation and reliability of semiconductor packages, particularly during load-dump pulses, by using a conductive heat dissipation block and moisture removal features, enhancing performance in high-power and transient voltage environments.
Implementation Method 1
a heat dissipation block, where the chip linker is coupled between the semiconductor chip and the heat dissipation block. The heat dissipation block is configured for removing heat from the semiconductor chip during operation
Implementation Method 2
utilizing conductive materials like copper or copper alloys for enhanced heat absorption and moisture removal
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A discrete semiconductor packaging structure and associated methods thereof. The structure includes a housing, a chip assembly pad being encapsulated by the housing, where the chip assembly pad is configured for coupling to a semiconductor chip. The structure further includes one or more leads, at least partially encapsulated by the housing, a clip including one or more terminals and a chip linker, where the terminals being configured for coupling to one or more leads, and a heat dissipation block, where the chip linker being coupled between the semiconductor chip and the heat dissipation block. The heat dissipation block is configured for removing heat from the semiconductor chip during operation.