Semiconductor Package Heat Dissipation With Anisotropic Heat Blocking
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Solution Overview
Problem
In heterogeneous integrated semiconductor packages, heat dissipation is a challenge due to the presence of components that can be damaged by high temperatures, as existing heat dissipation methods lack control over heat conduction, potentially harming heat-sensitive devices despite effective heat transfer from heat-source devices.
Innovation Solution
The implementation of an anisotropic heat conducting zone within the heat dissipation structure, which includes a vapor chamber and a wick structure, enhances heat conduction in a preferred direction, allowing for efficient heat transfer from heat-source devices to heat sinks while minimizing lateral heat conduction to heat-sensitive devices, thereby protecting them from excessive heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation methods are used to transfer heat from heat-source devices, then heat transfer efficiency is improved, but heat-sensitive devices may be damaged by lateral heat conduction
Solution Approach 1:
The heat dissipation structure is divided into different zones with distinct thermal properties: a first region with high thermal conductivity for vertical heat transfer, and a second region with low thermal conductivity for lateral heat blocking. This spatial differentiation of thermal properties enables simultaneous heat dissipation and heat-sensitive device protection.
Solution Approach 2:
The heat dissipation structure is segmented into multiple functional regions: a heat dissipation region directly contacting heat-source devices for efficient heat absorption, and a heat blocking region positioned between the heat dissipation structure and heat-sensitive devices to prevent lateral heat conduction. This segmentation allows independent optimization of heat transfer and heat protection functions.
2Reliability
If a heat dissipation structure is added to control heat conduction, then heat management is improved, but device complexity increases
Solution Approach 1:
The heat dissipation structure serves multiple functions simultaneously: it acts as a heat sink for heat-source devices, a thermal barrier for heat-sensitive devices, and a structural component of the semiconductor package. This multi-functionality reduces the need for separate heat management components.
Solution Approach 2:
The heat dissipation structure employs composite material design with regions of different thermal conductivities, enabling both heat dissipation and heat blocking functions within a single integrated component rather than requiring multiple separate materials or structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the maximum temperature of heat-source devices by 16% and heat-sensitive devices by 12%, improving heat management and preventing damage from heat conduction, while maintaining structural integrity and reducing manufacturing costs.
Implementation Method 1
a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component
Implementation Method 2
The heat dissipation element includes a vapor chamber and a wick structure, enhances heat conduction in a preferred direction
Implementation Method 3
the heat transmitting portion is configured to reduce a first expansion of the heat dissipating portion caused by the heat dissipating portion absorbing heat generated by the heat source
Data Source
AI summary
A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.