Semiconductor Package Thermal Management via Heat Blocking Member
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Solution Overview
Problem
Semiconductor packages face challenges in reducing thermal interference between chips and efficiently releasing heat, which affects the operational performance and reliability of semiconductor chips.
Innovation Solution
A semiconductor package design that includes a package substrate, an interposer, a first semiconductor chip, and multiple second semiconductor chips stacked vertically, with a heat radiation member and a heat blocking member to manage heat transfer and block thermal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are integrated in a semiconductor package, then the functionality and storage capacity are improved, but thermal interference between chips increases
Solution Approach 1:
The semiconductor package is divided into separate functional regions with different chips (e.g., logic chips and memory chips) positioned in specific spatial arrangements. This segmentation allows independent thermal management for each chip type, reducing mutual thermal interference while maintaining integrated functionality.
Solution Approach 2:
Heat blocking members (such as heat reflective layers or thermal barriers) are introduced as intermediary elements between adjacent semiconductor chips. These intermediaries block or redirect heat flow from high-temperature chips to low-temperature chips, preventing thermal interference while allowing both chips to function.
2Loss of energy
If heat radiation member is added to release heat, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heat radiation member is merged with the package substrate or interposer structure, forming an integrated thermal management system. This combination eliminates the need for separate heat dissipation components while maintaining effective heat release, thus improving heat dissipation without proportionally increasing device complexity.
Solution Approach 2:
The package substrate serves multiple functions: mechanical support for chips, electrical interconnection through trace patterns, and heat dissipation through integrated heat radiation structures. This multi-functionality reduces the need for additional dedicated heat management components.
3Area of stationary object
If chips are arranged closely to reduce package size, then miniaturization is achieved, but thermal interference between chips worsens
Solution Approach 1:
Different regions of the package are assigned different thermal management properties. Heat blocking members are strategically placed in specific locations between chips that generate excessive heat, creating localized thermal barriers where needed while maintaining close chip spacing in other regions for miniaturization.
Solution Approach 2:
Thermal management is extended from two-dimensional chip placement to three-dimensional spatial arrangement. Heat blocking members are positioned in vertical layers or at specific depths between chips, utilizing the third dimension to block heat paths without increasing the horizontal package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal interference and enhances the operational performance and structural reliability of semiconductor chips by rapid heat dissipation and strategic heat blocking.
Implementation Method 1
a heat radiation member arranged on the logic semiconductor chip and the plurality of semiconductor stack structures
Implementation Method 2
a heat blocking member extending from a portion of the heat radiation member and arranged in at least one space among a first space between the first semiconductor chip and at least one of the plurality of second semiconductor chips
Data Source
AI summary
A semiconductor package is provided that includes: a package substrate; an interposer mounted on the package substrate; a first semiconductor chip mounted on the interposer; a plurality of second semiconductor chips mounted on the interposer to surround at least a portion of the first semiconductor chip; a heat radiation member arranged on the first semiconductor chip and the plurality of second semiconductor chips; and a heat blocking member extending from a portion of the heat radiation member and arranged in at least one space among a first space between the first semiconductor chip and at least one of the plurality of second semiconductor chips and a second space between at least two of the plurality of second semiconductor chips.