Semiconductor Package Heat Conduction Layout for Thermal Dissipation
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Solution Overview
Problem
The increasing power consumption and thermal characteristics of semiconductor packages pose challenges in effectively dissipating heat, particularly as they become faster and more complex, with existing heat dissipation methods not adequately addressing the thermal management needs.
Innovation Solution
A semiconductor package system is designed with a substrate, multiple semiconductor packages, passive elements, and a heat dissipation structure, featuring heat conduction layers that facilitate efficient heat transfer from the semiconductor packages to the heat dissipation structure, with the thickness of the heat conduction layers optimized to enhance thermal conductivity and manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the semiconductor package speed and capacity are increased, then the processing performance is improved, but the power consumption and heat generation increase
Solution Approach 1:
The heat dissipation system is segmented into multiple functional layers: heat conduction layers (first and second) with different thicknesses, a heat dissipation structure, and a recessed region. This segmentation allows optimized heat transfer paths for different areas, enabling effective thermal management for high-speed semiconductor packages with increased power consumption.
2Device complexity
If conventional heat dissipation methods are used, then the structure is simple, but the thermal management effectiveness is insufficient
Solution Approach 1:
The heat conduction layers are designed with non-uniform thickness: the first heat conduction layer has a greater thickness than the second heat conduction layer. This local quality variation optimizes heat transfer efficiency in different regions, providing enhanced thermal management effectiveness while maintaining reasonable structural complexity.
3Length of stationary object
If the heat conduction layer thickness is increased, then the heat transfer path is extended, but the thermal resistance increases
Solution Approach 1:
The first heat conduction layer is designed with greater thickness than the second heat conduction layer, creating localized thermal management zones. This allows the system to optimize heat transfer efficiency by providing thicker insulation where needed while maintaining thinner layers in other areas to minimize thermal resistance, thus resolving the contradiction between extended heat transfer path and heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved thermal characteristics and operating performance by efficiently transferring heat from the semiconductor packages to the heat dissipation structure, thereby enhancing the overall thermal management and reliability of the semiconductor package system.
Implementation Method 1
a first heat conduction layer between the first semiconductor package and the heat dissipation structure
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
Described is a semiconductor package system. The system includes a substrate, a first semiconductor package on the substrate, a second semiconductor package on the substrate, a first passive element on the substrate, a heat dissipation structure on the first semiconductor package, the second semiconductor package, and the first passive element, and a first heat conduction layer between the first semiconductor package and the heat dissipation structure. A sum of a height of the first semiconductor package and a height of the first heat conduction layer may be greater than a height of the first passive element. The height of the first semiconductor package may be greater than a height of the second semiconductor package.