Semiconductor Package Heat Dissipating Element Integration
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently dissipating heat and maintaining thermal integrity during the manufacturing process, particularly in 3D packaging and 3DIC devices, which can lead to reliability issues and increased costs due to the complexity of integrating heat dissipating elements and ensuring proper thermal coupling.
Innovation Solution
A method involving the integration of heat dissipating elements, such as a base layer and adhesive layer, directly bonded to semiconductor dies before dicing, followed by a redistribution circuit structure and encapsulation, allowing for efficient heat dissipation and improved thermal management within the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipating elements are integrated into the package structure, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipating element with the package structure by integrating it into the substrate, creating a unified component that serves both structural and thermal management functions. This merging approach improves heat dissipation efficiency while avoiding the complexity of separate heat dissipation components.
Solution Approach 2:
The substrate is designed to serve multiple functions: it provides mechanical support for the semiconductor device and simultaneously acts as a heat dissipating element through its thermally conductive properties. This multi-functionality reduces the need for additional dedicated heat dissipation components, thereby improving thermal management without proportionally increasing device complexity.
2Ease of manufacture
If heat dissipating elements are integrated early in the manufacturing process, then manufacturing complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The heat dissipating element is integrated into the substrate during the substrate formation stage, before the semiconductor device is mounted. This preliminary integration ensures that the thermal management infrastructure is already in place, simplifying subsequent assembly steps and reducing the need for complex post-assembly thermal coupling operations.
Solution Approach 2:
The substrate acts as an intermediary component that provides a standardized interface for both mechanical mounting and thermal coupling. By pre-configuring the substrate with heat dissipating features, the patent creates a mediator that simplifies the connection between the semiconductor device and the thermal management system, reducing the precision requirements for direct device-to-heat-sink coupling.
3Reliability
If thermal coupling is ensured in 3D packaging, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the thermal coupling function into the package structure itself by making the substrate thermally conductive. This integration ensures reliable thermal pathways from the semiconductor device through the substrate to the external environment, improving thermal integrity without requiring separate complex thermal coupling mechanisms in the 3D packaging architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation efficiency, maintains thermal integrity, and simplifies the manufacturing process by integrating heat dissipating elements early in the semiconductor die formation, thereby improving the reliability and cost-effectiveness of the package structure.
Implementation Method 1
an adhesive layer 220 disposed between the semiconductor die 100 and the base layer 210, wherein the adhesive layer 220 thermally couples the heat dissipating element 200 to the semiconductor die 100
Data Source
AI summary
A package structure includes a circuit element, a first semiconductor die, a second semiconductor die, a heat dissipating element, and an insulating encapsulation. The first semiconductor die and the second semiconductor die are located on the circuit element. The heat dissipating element connects to the first semiconductor die, and the first semiconductor die is between the circuit element and the heat dissipating element, where a sum of a first thickness of the first semiconductor die and a third thickness of the heat dissipating element is substantially equal to a second thickness of the second semiconductor die. The insulating encapsulation encapsulates the first semiconductor die, the second semiconductor die and the heat dissipating element, wherein a surface of the heat dissipating element is substantially leveled with the insulating encapsulation.