Semiconductor Package Heat-Dissipating Resin for Display Driver Chips
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Solution Overview
Problem
High-resolution display devices face challenges in heat dissipation due to increased operation frequency, which can lead to overheating of driver chips, necessitating improved thermal management in semiconductor packages.
Innovation Solution
A semiconductor package design featuring a film with a wiring pattern layer, insulating layers, and a heat dissipating layer made of synthetic resin, which covers the semiconductor chips to effectively manage heat dissipation by using metal layers to transfer and dissipate heat generated by the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If operation frequency is increased to achieve high-resolution display, then display performance is improved, but driver chip temperature increases causing heat dissipation problems
Solution Approach 1:
A heat dissipating layer made of thermally conductive synthetic resin is introduced as an intermediary between the driver chip and the external environment. This layer has high thermal conductivity to efficiently transfer heat away from the chip while maintaining electrical insulation properties, thus resolving the heat dissipation problem without affecting display performance.
Solution Approach 2:
The heat dissipating layer uses a composite material approach by employing synthetic resin with enhanced thermal conductivity properties. This composite material combines the electrical insulation advantages of resin with improved heat dissipation capabilities, allowing the driver chip to operate at high frequencies without overheating.
2Temperature
If heat dissipating layer is added to improve thermal management, then heat dissipation function is improved, but package structure complexity increases
Solution Approach 1:
The heat dissipating layer performs multiple functions simultaneously: it provides thermal management by conducting heat away from the chip, maintains electrical insulation between conductive elements, and offers mechanical protection to the driver chip. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in package complexity.
Solution Approach 2:
The patent merges the heat dissipation function with the existing package structure by integrating the heat dissipating layer into the packaging process. This layer is combined with other package elements to form a unified structure that achieves thermal management without requiring separate complex cooling systems or additional structural components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency, reducing the risk of overheating and improving the performance and reliability of high-resolution display devices by effectively managing thermal loads.
Implementation Method 1
a heat dissipating layer covering the semiconductor chip and made of a synthetic resin
Data Source
AI summary
There is provided a semiconductor package with improved heat dissipation function. The semiconductor package comprising, a film, a wiring pattern layer disposed on the film, and including a first area and a second area surrounding the first area, a semiconductor chip disposed on the first area of the wiring pattern layer and electrically connected to the wiring pattern layer, a first insulating layer disposed on the second area of the wiring pattern layer, a first metal layer disposed on the first insulating layer and spaced apart from the semiconductor chip and a heat dissipating layer covering the semiconductor chip and made of a synthetic resin.