Semiconductor Package Heat Dissipation via Embedded Bonding Material
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving effective heat dissipation and compact size, particularly for small-sized semiconductor chips with a large number of pins, which limits their integration and mounting on electronic device mainboards.
Innovation Solution
A semiconductor package design incorporating a connection structure with a redistribution layer, encapsulant, heat dissipation bonding material, and a heat dissipation element, where the heat dissipation bonding material is embedded in the encapsulant and extends to cover a support pattern, enhancing heat dissipation and allowing for a compact, efficient package configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a fan-out semiconductor package is used to achieve compact size and multiple pins, then the package size is reduced and pin count is increased, but heat dissipation characteristics deteriorate
Solution Approach 1:
The patent segments the heat dissipation function by introducing a dedicated heat dissipation element (heat sink) as a separate component bonded to the semiconductor chip. This allows the main package body to remain compact while the heat sink extends outward to provide effective heat dissipation surface area, resolving the contradiction between small package size and heat dissipation performance.
Solution Approach 2:
The patent adds a vertical dimension to heat dissipation by bonding the heat sink to the inactive surface of the semiconductor chip (opposite to the active surface with connection pads). This enables heat dissipation in the Z-direction (vertical) while maintaining compact footprint in the X-Y plane, allowing compact package size with effective heat dissipation.
2Temperature
If heat dissipation elements are added to improve thermal management, then heat dissipation characteristics improve, but device complexity increases
Solution Approach 1:
The heat dissipation bonding material serves multiple functions: it bonds the heat sink to the semiconductor chip, provides thermal conduction path for heat dissipation, and fills the space between components. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved heat dissipation.
Solution Approach 2:
The patent merges the bonding function and heat dissipation function into a single heat dissipation bonding material layer. This material simultaneously provides mechanical bonding and thermal conduction, consolidating multiple functions into one component and minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation characteristics and enables the integration of small-sized semiconductor chips with a large number of pins on electronic device mainboards, addressing spatial limitations and thermal management issues.
Implementation Method 1
a heat dissipation bonding material has a portion embedded in the encapsulant in a region overlapping the semiconductor chip and extends to the upper surface of the encapsulant
Implementation Method 2
a heat dissipation element is bonded to the upper surface of the encapsulant by the heat dissipation bonding material
Data Source
AI summary
A semiconductor package includes a connection structure having first and second surfaces opposing each other and including a redistribution layer. A semiconductor chip is disposed on the first surface of the connection structure and has connection pads connected to the redistribution layer. An encapsulant is disposed on the first surface of the connection structure and covers the semiconductor chip. A support pattern is disposed on a portion of an upper surface of the encapsulant. A heat dissipation bonding material has a portion embedded in the encapsulant in a region overlapping the semiconductor chip and extends to the upper surface of the encapsulant so as to cover the support pattern. A heat dissipation element is bonded to the upper surface of the encapsulant by the heat dissipation bonding material.