Semiconductor Package Heat Dissipation Element Inclined Surface
Solution Overview
Problem
Current semiconductor packages face challenges in effectively dissipating heat and enhancing the structural strength of semiconductor chips and heat dissipation elements exposed externally, which affects their performance and reliability.
Innovation Solution
The semiconductor package design incorporates a heat dissipation element with an inclined surface and a package molding portion on a mounting substrate, where the heat dissipation element's upper surface is parallel to the semiconductor chip's surface, and the angle between the surfaces is an obtuse angle, ranging from 115 to 170 degrees, to improve heat dissipation and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat dissipation element is exposed to the outside for effective heat dissipation, then heat dissipation efficiency is improved, but the structural strength and reliability during assembly process deteriorates
Solution Approach 1:
The patent applies beforehand cushioning by forming a package molding portion that covers and protects the heat dissipation element before the assembly process occurs. The molding portion acts as a protective layer that prevents damage during grinding and assembly operations, while still allowing the heat dissipation element to function effectively by exposing necessary surfaces for heat dissipation.
2Reliability
If the semiconductor chip is exposed to the outside for electrical connection, then electrical connectivity is improved, but the chip becomes vulnerable to damage during assembly process
Solution Approach 1:
The package molding portion is formed beforehand to protect the semiconductor chip during assembly operations. The molding material provides mechanical protection and cushioning against forces applied during grinding and assembly, while the chip remains electrically connected and functional.
3Temperature
If heat dissipation element is exposed for thermal management, then thermal performance is improved, but the element becomes susceptible to damage from external forces
Solution Approach 1:
The package molding portion provides beforehand protection against external forces such as impact and mechanical stress. It acts as a cushioning layer that absorbs and distributes external forces, protecting the heat dissipation element while allowing it to maintain its thermal management function through exposed surfaces.
Data Source
AI summary
A semiconductor package includes a mounting substrate, a first semiconductor chip on the mounting substrate and electrically connected to the mounting substrate, a heat dissipation element on an upper surface of the first semiconductor chip, where the heat dissipation element comprises a sidewall comprising an inclined surface and an upper surface directly connected to the inclined surface, and a package molding portion on the mounting substrate and the inclined surface of the heat dissipation element. The package molding portion exposes at least a portion of the upper surface of the heat dissipation element, the upper surface of the heat dissipation element is parallel to the upper surface of the first semiconductor chip, and an angle formed by the upper surface of the heat dissipation element and the inclined surface of the heat dissipation element is an obtuse angle.