Semiconductor Package Heat Dissipation Part Design
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Solution Overview
Problem
Semiconductor packages face challenges in effectively managing heat dissipation, particularly with increasing power consumption leading to thermal issues that affect the reliability and performance of both lower and upper semiconductor chips.
Innovation Solution
A semiconductor package design featuring a heat dissipation part strategically positioned over a hot spot on the lower semiconductor chip, using a heat slug with a thermal interface material layer, and an upper package spaced apart to prevent heat transfer to the upper chips, enhancing thermal conductivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation part is provided on the lower package to cover a portion of the lower semiconductor chip, then heat dissipation from hot spots is improved, but the upper package cannot be stacked directly over the entire lower package area
Solution Approach 1:
The lower package is divided into a first region with a heat dissipation part and a second region without it. The upper package is stacked only on the second region, allowing the heat dissipation part to be exposed on the side surface. This segmentation enables simultaneous heat dissipation functionality and upper package stacking.
Solution Approach 2:
The heat dissipation part is positioned such that it extends beyond the upper package in the lateral direction, allowing heat dissipation to occur through the side surface of the lower package. This dimensional arrangement enables heat dissipation without interfering with the upper package stacking.
2Volume of moving object
If the upper package is stacked vertically on the lower package, then space utilization is improved, but heat from the lower chip may transfer to the upper chip
Solution Approach 1:
The heat dissipation part is extracted and exposed on the side surface of the lower package by not stacking the upper package over the first region. This removes the heat trap that would otherwise occur if the upper package covered the entire lower package area, allowing heat to escape laterally.
Solution Approach 2:
The side surface of the lower package acts as an intermediary heat dissipation path between the lower semiconductor chip and the environment. By exposing the heat dissipation part on the side surface, heat can be dissipated through this intermediate path without directly transferring to the upper package.
3Productivity
If power consumption is increased to provide fast speed and increased capacity, then performance is improved, but thermal characteristics deteriorate
Solution Approach 1:
The heat dissipation part is strategically positioned at the first region where hot spots are generated in the lower semiconductor chip. This localized heat dissipation approach addresses thermal issues at the specific location of heat generation, enabling higher power consumption without compromising thermal characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation from hot spots, reducing thermal stress on upper chips and enabling the use of heat-sensitive semiconductor chips, thereby enhancing operational reliability and flexibility in chip types.
Implementation Method 1
a heat dissipation part provided adjacent to a first side of the lower substrate on the exposed portion of the lower semiconductor chip
Data Source
AI summary
A semiconductor package includes a lower package with a lower substrate and a lower semiconductor chip. A heat dissipation part is provided adjacent to a side of the lower package and covers a portion of the lower semiconductor chip, and an upper package is on the lower package and is laterally spaced apart from the heat dissipation part.