Semiconductor Package Heat Dissipation Member Design
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Solution Overview
Problem
Semiconductor packages face challenges in heat dissipation and maintaining a bent shape due to the thinness of semiconductor chips and the increased volume of the package, which affects operation speed and performance.
Innovation Solution
A semiconductor package design featuring through-electrodes that protrude from the chip and a heat dissipation member with through-holes, an insulation layer, and a heat transfer adhesive, allowing for efficient heat dissipation and enabling the package to be configured in a bent shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation members are disposed on the outer surface of a semiconductor package, then heat dissipation is improved, but the volume of the semiconductor package increases
Solution Approach 1:
The heat dissipation member is positioned inside the semiconductor package, nested within the existing structure rather than adding external components. The through-electrodes serve dual purposes: electrical connection and structural support for the heat dissipation member, eliminating the need for separate mounting structures.
Solution Approach 2:
The through-electrodes perform multiple functions: providing electrical connections between bonding pads and external circuits, serving as mechanical anchors for the heat dissipation member, and enabling thermal conduction from the semiconductor chip to the heat dissipation member. This multi-functionality reduces the need for additional components.
2Volume of stationary object
If the thickness of a semiconductor chip becomes very thin to reduce package size, then the package volume decreases, but the package becomes bent and difficult to maintain structural integrity
Solution Approach 1:
The heat dissipation member acts as a flexible structural element that can accommodate the bending of thin semiconductor chips. The through-holes in the heat dissipation member allow it to flex while maintaining its heat dissipation function, preventing structural failure of the thin chip assembly.
Solution Approach 2:
The heat dissipation member is integrated with the through-electrodes and semiconductor chip into a unified structure. The through-electrodes pass through both the chip and heat dissipation member, creating a mechanically coupled assembly that maintains stability even when the thin chip bends.
3Adaptability or versatility
If through-electrodes are made to protrude outward to enable bent package configuration, then adaptability to bent shapes is improved, but electrical connection reliability may be compromised
Solution Approach 1:
The protruding portions of the through-electrodes are nested within the through-holes of the heat dissipation member, creating a protected configuration. This nesting allows the electrodes to extend beyond the chip for bent package flexibility while being shielded by the heat dissipation member structure.
Solution Approach 2:
The heat dissipation member serves as an intermediary structure between the through-electrodes and the external environment. It provides mechanical support and protection to the protruding electrode portions while maintaining electrical connection pathways through its through-holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by the semiconductor chip, improving its performance and allowing for the creation of a bent semiconductor package without structural damage.
Implementation Method 1
a heat dissipation member facing the second surface of the semiconductor chip and defined with through-holes coupled with the portion of the through-electrodes that protrudes outward from the second surface of the semiconductor chip
Implementation Method 2
an insulation layer formed on a surface of the metal body in order to electrically insulate the heat dissipation member away form the semiconductor chip and the through-electrodes
Implementation Method 3
a heat transfer adhesive member interposed between the heat dissipation member and the second surface and containing a heat transfer substance and an adhesive
Data Source
AI summary
A semiconductor package having a heat dissipation member capable of efficiently conveying excess heat away from semiconductor chips is presented. The semiconductor package includes a semiconductor chip, through-electrodes, and a heat dissipation member. The semiconductor chip has a first surface, a second surface facing away from the first surface, and bonding pads which are disposed on the first surface. The through-electrodes are electrically connected with the bonding pads and passing through the first and second surfaces of the semiconductor chip, and protrude outward from the second surface. The heat dissipation member faces the second surface of the semiconductor chip and is coupled to the through-electrodes.